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2024 International Conference on Electronics Packaging (ICEP) ,
1
Cu/SnAg Pillar Bump Joints on Ni-Less Surface Finish in Las..:
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Proceedings of the 10th International Conference on Virtual Reality Continuum and Its Applications in Industry ,
4
An interface between users and virtual objects using two ha..:
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Proceedings of the IFIP WG10.3 working conference on Parallel architectures and compilation techniques ,
5
Effects of data bundling in non-strict data structures:
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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
6
Improvement of PCB reliability under HAST conditions by enh..:
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2020 20th European Conference on Radiation and Its Effects on Components and Systems (RADECS) ,
7
Diagnostics of Low-Flux Proton Beams for Radiation Effect T..:
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2019 49th European Microwave Conference (EuMC) ,
8
25–40 GHz 180° Reflective-Type Phase Shifter using 65-nm CM..:
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2013 Fifth International Conference on Ubiquitous and Future Networks (ICUFN) ,
9
Estimated position error compensation in localization using..:
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2006 37th IEEE Power Electronics Specialists Conference ,
10
A single switch energy recovery circuit for low cost plasma..:
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IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. ,
11
Local-damascene-finFET DRAM integration with p/sup +/ doped..:
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2022 IEEE Custom Integrated Circuits Conference (CICC) ,
12
A 60-Gb/s/pin single-ended PAM-4 transmitter with timing sk..:
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2007 IEEE Symposium on VLSI Technology ,
13
A Nanowire Transistor for High Performance Logic and Terabi..:
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Proceedings of the 7th International Symposium on Quality Electronic Design ,
14
Sensing Margin Analysis of MLC Flash Memories Using a Novel..:
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2023 IEEE EMBS International Conference on Biomedical and Health Informatics (BHI) ,
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