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X
Oh, Joo Suk
84  Ergebnisse:
Buchkapitel (Online) X
englisch X
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1

LightTrader : World's first AI-enabled High-Frequency Tradi..:

, In: 2022 IEEE Hot Chips 34 Symposium (HCS),
Kim, Hyunsung ; Yoo, Sungyeob ; Bae, Jaewan... - p. 1-10 , 2022
Link: https://doi.org/10.1109/..
 
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2

List of Contributors:

, In: Bladder Cancer,
Burton, Jeremy P. ; Chanyi, Ryan M. ; Cho, Jeong Y.... - p. xxi-xxiii , 2018
Link: https://doi.org/10.1016/..
 
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3

Systematic study on bias temperature instability of various..:

, In: 2009 IEEE International Reliability Physics Symposium,
Jung, Hyung-Suk ; Park, Tae Joo ; Kim, Jeong Hwan... - p. None , 2009
Link: https://doi.org/10.1109/..
 
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4

Wireless, Battery-Free, Multi-Modal Sensor System for Conti..:

, In: 2023 IEEE SENSORS,
Cho, Seokjoo ; Han, Hyeonseok ; Oh, Yong Suk. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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5

Self-Powered/Wireless-Powered Physical Sensors for Healthca..:

, In: 2023 IEEE SENSORS,
Park, Inkyu ; Choi, Jungrak ; Gu, Jimin... - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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6

A 16Gb 27Gb/s/pin T-coil based GDDR6 DRAM with Merged-MUX T..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Lee, Daewoong ; Kwon, Hye-Jung ; Kwon, Daehyun... - p. 446-448 , 2022
Link: https://doi.org/10.1109/..
 
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7

Gracilis Insetting Under SMAS in Smile Reanimation:

, In: Facial Palsy,
Oh, Tae suk ; Kim, Min Ji - p. 367-373 , 2021
Link: https://doi.org/10.1007/..
 
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8

Effective Substrate Thermal Conductivity Modeling Method Ex..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Hwang, Seungtae ; Lee, Bang weon ; Kim, Taehwan... - p. 244-248 , 2020
Link: https://doi.org/10.1109/..
 
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9

Electrical and Thermal Co-Analysis of Thermally Efficient S..:

, In: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS),
Kim, Sang Kyu ; Oh, DanKyung Suk ; Hwang, Seungtae... - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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10

Development of Plasma-Damage Free Neutral Beam Sputtering S..:

, In: 2008 Flexible Electronics and Displays Conference and Exhibition,
Jang, Jin-Nyoung ; Park, Young Chun ; Hong, MunPyo... - p. None , 2008
Link: https://doi.org/10.1109/..
 
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11

History of "Making a Thumb":

, In: The Thumb,
Oh, Suk Joon - p. 3-9 , 2019
Link: https://doi.org/10.1007/..
 
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12

Equivalent thermal conductivity of a composite structure co..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Hyun, Younghoon ; Lee, Bruce Weon ; Wook Jung, Ki... - p. 1-8 , 2022
Link: https://doi.org/10.1109/..
 
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13

Thermal Modeling and Analysis of High Bandwidth Memory in 2..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Kim, Taehwan ; Lee, Jonggyu ; Kim, Jaechoon... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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14

Assessment of Thermal-aware Floorplans in a 3D IC for Serve..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Jung, Ki Wook ; Cho, Eunho ; Jo, Sungeun... - p. 1036-1047 , 2022
Link: https://doi.org/10.1109/..
 
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15

Power Integrity Performance Gain of a Novel Integrated Stac..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Song, Eunseok ; Oh, Dan Kyung Suk ; Cha, Seung-Yong... - p. 1358-1362 , 2020
Link: https://doi.org/10.1109/..
 
1-15