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2022 IEEE Hot Chips 34 Symposium (HCS) ,
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LightTrader : World's first AI-enabled High-Frequency Tradi..:
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2009 IEEE International Reliability Physics Symposium ,
3
Systematic study on bias temperature instability of various..:
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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
6
A 16Gb 27Gb/s/pin T-coil based GDDR6 DRAM with Merged-MUX T..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
8
Effective Substrate Thermal Conductivity Modeling Method Ex..:
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2019 Electrical Design of Advanced Packaging and Systems (EDAPS) ,
9
Electrical and Thermal Co-Analysis of Thermally Efficient S..:
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2008 Flexible Electronics and Displays Conference and Exhibition ,
10
Development of Plasma-Damage Free Neutral Beam Sputtering S..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
12
Equivalent thermal conductivity of a composite structure co..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
13
Thermal Modeling and Analysis of High Bandwidth Memory in 2..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
14
Assessment of Thermal-aware Floorplans in a 3D IC for Serve..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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