Bow, Eric J.
2  Ergebnisse:
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A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Iacovo, Serena ; D'have, Koen ; Okudur, Oguzhan Orkut... - p. 1410-1417 , 2023
 
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