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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Advanced FO-PLP with Multi-chip for Wearable Application:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
2
Advanced Fan-Out Panel Level Package (FO-PLP) Development f..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
3
Thermal Improvement of HBM with Joint Thermal Resistance Re..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
4
Advanced Chip Last Process Integration for Fan Out WLP:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
5
Study of reliable via structure for Fan Out Panel Level Pac..:
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Proceedings of the 8th ACM SIGSAC symposium on Information, computer and communications security ,
6
An empirical study on the software integrity of virtual app..:
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Proceedings of the 9th ACM SIGGRAPH Conference on Virtual-Reality Continuum and its Applications in Industry ,
7
Development of directional olfactory display:
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2016 Progress in Electromagnetic Research Symposium (PIERS) ,
8
Local surface potential characterization of nanostructures:..:
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IET 8th International Conference on Computation in Electromagnetics (CEM 2011) ,
9
Reliability analysis of the SMES system in the team worksho..:
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Global Perspectives on Korean Literature ,
12