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2024 International Conference on Electronics Packaging (ICEP) ,
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Solder Joint Reliability Comparison Under JEDEC Drop and Sy..:
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2024 International Conference on Electronics Packaging (ICEP) ,
2
Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:
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2023 International Conference on Electronics Packaging (ICEP) ,
3
Post-Buckling Analysis for Addressing Asymmetric Warping of..:
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2023 IEEE CPMT Symposium Japan (ICSJ) ,
4
Board-Level Drop Reliability Analysis for Fine-Pitch BGA Pa..:
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2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition Workshops (CVPRW) ,
5
A Closer Look at Geometric Temporal Dynamics for Face Anti-..:
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2023 IEEE International Conference on Image Processing (ICIP) ,
6
Rethinking Long-Tailed Visual Recognition with Dynamic Prob..:
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2023 IEEE 17th International Conference on Automatic Face and Gesture Recognition (FG) ,
7
Generalized Face Anti-Spoofing via Multi-Task Learning and ..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
8
Reliability Prediction and Improvement of Board-Level Therm..:
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2023 IEEE 19th International Conference on Automation Science and Engineering (CASE) ,
9
Boosting Unsupervised Domain Adaptation for 3D Object Detec..:
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International Conference on Innovation, Communication and Engineering (ICICE 2023) ,
10
Promising implicit indication by fitting algorithm on MOSFE..:
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2022 26th International Conference on Pattern Recognition (ICPR) ,
11
Extremely Low-Light Image Enhancement with Scene Text Resto..:
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Lecture Notes in Computer Science; Pattern Recognition ,
12
Confidence-Aware Anomaly Detection in Human Actions:
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2022 IEEE/CVF Winter Conference on Applications of Computer Vision (WACV) ,
13
Disentangled Representation with Dual-stage Feature Learnin..:
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Computer Vision – ACCV 2020; Lecture Notes in Computer Science ,
14
3D Object Detection from Consecutive Monocular Images:
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2019 IEEE International Conference on Image Processing (ICIP) ,
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