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X
Lim, W.-W
278  Ergebnisse:
Buchkapitel (Online) X
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1

A 2.6 mV/b Resolution, 1.2 GHz Throughput, All-Digital Volt..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Augustine, C. ; Meinerzhagen, P. ; Lim, W.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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2

Highly Reliable and Manufacturable MRAM embedded in 14nm Fi..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Ko, S. ; Park, J. H. ; Bak, J. H.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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3

Number plate recognition in noisy image:

, In: 2015 8th International Congress on Image and Signal Processing (CISP),
Nguwi, Y. Y. ; Lim, W. J. - p. 476-480 , 2015
Link: https://doi.org/10.1109/..
 
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4

Novel Heat Dissipating Cell Scheme for Improving a Reset Di..:

, In: 2007 IEEE Symposium on VLSI Technology,
Kang, D.H. ; Yu, J. ; Kong, J.H.... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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5

Highly Reliable 256Mb PRAM with Advanced Ring Contact Techn..:

, In: 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers.,
Song, Y.J. ; Kong, J. ; Ahn, S.... - p. 118-119 , 2006
Link: https://doi.org/10.1109/..
 
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6

Device Design and Reliability of GAA MBCFET:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Kang, M. ; Chang, M. ; Park, Y.... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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7

Comprehensive study on prediction of endurance properties f..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Sato, H. ; Shin, H. M. ; Jung, H.... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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8

Characterization of Commercial Solder Mask in Printed Circu..:

, In: Springer Proceedings in Materials; Proceedings of the 19th Asian Workshop on Polymer Processing (AWPP 2022),
Lim, W. Y. L. ; Mariatti, M. ; Ku Marsilla, K. I... - p. 239-249 , 2023
Link: https://doi.org/10.1007/..
 
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9

28nm CIS-Compatible Embedded STT-MRAM for Frame Buffer Memo..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Lee, K. ; Kim, D. S. ; Bak, J. H.... - p. 2.1.1-2.1.4 , 2021
Link: https://doi.org/10.1109/..
 
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10

A novel integration of STT-MRAM for on-chip hybrid memory b..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Park, J.-H. ; Lee, J. ; Jeong, J.... - p. 2.5.1-2.5.4 , 2019
Link: https://doi.org/10.1109/..
 
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11

From Technical Analysis to Text Analytics: Stock and Index ..:

, In: 2019 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, Automation and Mechatronics (RAM),
Teoh, T.-T. ; Lim, W. T. ; Koh, K. W.... - p. 496-500 , 2019
Link: https://doi.org/10.1109/..
 
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12

Graphene (oxide) for photonic integration:

, In: 2016 Progress in Electromagnetic Research Symposium (PIERS),
De La Rue, R. M. ; Lai, C. K. ; Lim, W. H.... - p. 1614-1614 , 2016
Link: https://doi.org/10.1109/..
 
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13

On-Line reconfigurable hardware implementations for FEC and..:

, In: IEE Colloquium on DSP enabled Radio,
Benaissa, M. ; Lim, W.M. - p. 1-6 , 2003
Link: https://doi.org/10.1049/..
 
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14

Panel: The Reusably Incorrect Forum:

, In: Proceedings. Fifth International Conference on Software Reuse (Cat. No.98TB100203),
Lim, W.C. ; Favaro, J. ; Lillie, C... - p. 358,359 , 1998
Link: https://doi.org/10.1109/..
 
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15

Vortex-Induced Stall on an Actively Twisted Highly Loaded M..:

, In: Notes on Numerical Fluid Mechanics and Multidisciplinary Design; New Results in Numerical and Experimental Fluid Mechanics XIV,
Wilke, Gunther A. ; van der Wall, Berend G. ; Tanabe, Yasutada... - p. 623-633 , 2023
Link: https://doi.org/10.1007/..
 
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