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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Void Migration Kinetics in Fine Line Cu RDL under Electric ..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
2
The board level reliability performance and process challen..:
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2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC) ,
3
Breathing Sound Segmentation and Detection Using Transfer L..:
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2019 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-TW) ,
4
A Low-Complexity Color Image Compression Algorithm Based on..:
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2023 International Conference on Advanced Robotics and Intelligent Systems (ARIS) ,
5
A Laser Galvo System for Human-Robot Collaboration:
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2023 International Conference on Advanced Robotics and Intelligent Systems (ARIS) ,
6
The Fusion and Verification of 2D Human Skeleton and 3D Poi..:
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2023 International Conference on Advanced Robotics and Intelligent Systems (ARIS) ,
7
Combination of Semantic Segmentation and Skeleton Estimatio..:
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2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC) ,
8
Laser-light Visual Cueing Shoes with Foot Pressures and Ine..:
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2019 24th Microoptics Conference (MOC) ,
9
Skin Cancer Detection using Cellular Resolution Optical Coh..:
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Proceedings of the 2007 IEEE/WIC/ACM International Conferences on Web Intelligence and Intelligent Agent Technology - Workshops ,
10
Gene Name Service : No-Nonsense Alias Resolution Service..:
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Proceedings of the 2014 IEEE/WIC/ACM International Joint Conferences on Web Intelligence (WI) and Intelligent Agent Technologies (IAT) - Volume 03 ,
11
Content-Based Feature Matching for Fragment Reassembly of C..:
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2014 IEEE/WIC/ACM International Joint Conferences on Web Intelligence (WI) and Intelligent Agent Technologies (IAT) ,
12
Content-Based Feature Matching for Fragment Reassembly of C..:
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2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) ,
13
Dual Gate Oxide CMOS Process on 4H-SiC:
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2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
14
Signal Integrity Improvement on High-Speed Packaging Routin..:
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2016 IEEE 5th Global Conference on Consumer Electronics ,
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