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X
Lin, Zen-Ming
31  Ergebnisse:
Buchkapitel (Online) X
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1

Demonstration of A 3D Chip by Logic-DRAM Stacked Using Pair..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Lu, Chun-Lin ; Chen, Chun Cheng ; Lin, Sheng-Chieh... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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2

A High Frame Rate Affordable Nystagmus Detection Method wit..:

, In: SIGGRAPH Asia 2022 Posters,
Yang, Ting-Hua ; Hsieh, Hsien-Yuan ; Lin, Tse-Han.. - p. 1-2 , 2022
Link: https://dl.acm.org/doi/1..
 
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3

A 125μW, fully scalable MPEG-2 and H.264/AVC video decoder ..:

, In: 2006 IEEE International Solid State Circuits Conference - Digest of Technical Papers,
Lee, Chen-Yi ; Yang, Jiun-Yan ; Hou, Kang-Cheng... - p. 1576-1585 , 2006
Link: https://doi.org/10.1109/..
 
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4

Design of a 125μW, fully-scalable MPEG-2 and H.264/AVC vide..:

, In: Proceedings of the 43rd annual Design Automation Conference,
Liu, Tsu-Ming ; Chung, Ching-Che ; Lee, Chen-Yi.. - p. 288-289 , 2006
Link: https://dl.acm.org/doi/1..
 
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5

Zen-NAS: A Zero-Shot NAS for High-Performance Image Recogni..:

, In: 2021 IEEE/CVF International Conference on Computer Vision (ICCV),
Lin, Ming ; Wang, Pichao ; Sun, Zhenhong... - p. 337-346 , 2021
Link: https://doi.org/10.1109/..
 
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6

Stillness Moves : Exploring Body Weight-Transfer Learnin..:

, In: Proceedings of the 1st International Workshop on Multimedia Content Analysis in Sports,
Lin, Han Hong ; Han, Ping Hsuan ; Lu, Kuan Yin... - p. 21-29 , 2018
Link: https://dl.acm.org/doi/1..
 
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7

Ultra Thin Fan-Out 3D WLCSP Heterogeneous Integration Packa..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, Jay ; Zhang, Zen-Wei ; Lin, Vito... - p. 2107-2111 , 2024
Link: https://doi.org/10.1109/..
 
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8

Compared Various Algorithms of Artificial Intelligence to P..:

, In: 2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE),
Zheng, Lu ; Lin, Yu-Tong ; Huang, Jin-Hang... - p. 407-411 , 2023
Link: https://doi.org/10.1109/..
 
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9

All inorganic HTL/ETL Perovskite solar cells:

, In: 2022 IET International Conference on Engineering Technologies and Applications (IET-ICETA),
Hsu, Rui Yun ; Syu, Wei-Jhe ; Huang, Zen-Min. - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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10

The Study of Adding Anti-Solvent to Improve the Efficiency ..:

, In: 2022 IET International Conference on Engineering Technologies and Applications (IET-ICETA),
Hsu, Rui-Yun ; Cheng, Tsung-Chieh ; Huang, Zen-Min. - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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11

Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocry..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lin, Ang-Ying ; Lin, Yu-Min ; Lu, Chun-Lin... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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12

Dynamic Wavelength Switching for Open All-Photonics Network:

, In: NOMS 2024-2024 IEEE Network Operations and Management Symposium,
Chu, Li-Hsuan ; Tung, Yen-Lin ; Huang, Yong-Zen.. - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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13

Spring Perfectly Statically Balanced 1-DOF Mechanisms Using..:

, In: Advances in Mechanism and Machine Science; Mechanisms and Machine Science,
Hsu, Cheng-Hsuan ; Lin, Yu-Hsuan ; Jhuang, Chi-Shiun. - p. 429-437 , 2023
Link: https://doi.org/10.1007/..
 
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14

Force-Sensing Intelligent Vise for Cutting Dynamics Monitor..:

, In: 2023 IEEE SENSORS,
Chen, Po-Han ; Lin, Tay-Jyi ; Yeh, Chingwei.. - p. 01-04 , 2023
Link: https://doi.org/10.1109/..
 
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15

Integrated High Aspect Ratio 3D High Density Capacitor in S..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Lu, Chun-Lin ; Ho, Cheng-Shu ; Liu, Kuo-Wei... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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