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Proceedings of the 2023 11th International Conference on Computer and Communications Management ,
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A Novel Phase Generation Mechanism for PAPR Reduction in SL..:
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2022 International Conference on Electronics Packaging (ICEP) ,
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High thermal stability Cu-to-Cu joints fabricated by using ..:
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Proceedings of the 2020 ACM Symposium on Spatial User Interaction ,
3
TanGo: Exploring Expressive Tangible Interactions on Head-M..:
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Proceedings of the 2020 CHI Conference on Human Factors in Computing Systems ,
4
Glissade: Generating Balance Shifting Feedback to Facilitat..:
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2019 IEEE International Electron Devices Meeting (IEDM) ,
5
Monolithic 3D BEOL FinFET switch arrays using location-cont..:
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2019 Compound Semiconductor Week (CSW) ,
6
The underlying signatures of the spin- and momentum-forbidd..:
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2019 IEEE 90th Vehicular Technology Conference (VTC2019-Fall) ,
7
Pilot Sequence Design for Spectral Compactness and Channel ..:
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2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
8
Transient Thermal Damage Simulation for Novel Location-Cont..:
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2019 Compound Semiconductor Week (CSW) ,
9
Crystal Structures and Surface Plasmon Properties of GaZnO ..:
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Computer Vision – ACCV 2018; Lecture Notes in Computer Science ,
10
SemiStarGAN: Semi-supervised Generative Adversarial Network..:
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2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD) ,
11
High performance micromachined GaN on Si HEMT with backside..:
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2007 IEEE International Geoscience and Remote Sensing Symposium ,
12
Hierarchical classification systems for hyperspectral image..:
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2023 Sixth International Symposium on Computer, Consumer and Control (IS3C) ,
13
IoT Liquid Fertilizer Cooling Control System Designed for A..:
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2022 International Automatic Control Conference (CACS) ,
14
Collaborative Handling of Two-Wheeled Deformable Robots:
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GLOBECOM 2020 - 2020 IEEE Global Communications Conference ,
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