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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
3
Interconnect Stress Testing as a Tool for Assessment of Rel..:
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
6
Comparison of SAC and new Pb-free solder alloy for special ..:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
9