?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Signal & Power Integrity Optimization Utilizing Silicon Cor..:
, In:
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
Fine Pitch (≤ 10μm) Die to Wafer Cu-Cu TCB on Organic Polym..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
3
Optimization of 2.5D Organic Interposer Channel for Die and..:
, In:
?
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
4
Novel CMP Material Solution To Enable High Removal Rate Die..:
, In:
?
2020 IEEE Symposium on VLSI Technology ,
5
Low Temperature Cu/SiO2 Hybrid Bonding with Metal Passivati..:
, In:
?
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
6
New and Unique CMP Material Solution for the Enablement of ..:
, In:
?
Handbook for Cleaning/Decontamination of Surfaces ,
13