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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
1
A Study on Fine-Pitch Convertors for Radiation Detectors wi..:
, In:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
4
Stencil Printing and Flip-Chip Bonding for Assembly of Pixe..:
, In:
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Briefe / Samuel Beckett ; herausgegeben von George Craig (editor), Martha Dow Fehsenfeld (founding editor), Dan Gunn (editor) und Lois More Overbeck (general editor) ; für die deutschsprachige Ausgabe übersetzt und eingerichtet von Chris Hirte
4. Band ,
7
Was bleibt, wenn die Schreie enden?
, In:4. Band
Briefe 1966-1989
Exemplar:
Zentrale:E03 a ang 669 bec 2/424
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The letters of Samuel Beckett / George Craig (editor and French translator), Martha Dow Fehsenfeld (founding editor), Dan Gunn (editor), Lois More Overbeck (general editor)
Volume 4 ,
8
1966-1989:
, In:Volume 4
Exemplar:
Zentrale:E03 h ang 669 bec 2/004-4