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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
1
Multi-parameters optimization for electromigration in WLCSP..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
3
20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nan..:
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2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) ,
6
Investigating Mechanical Properties of Silicon Carbide Coat..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
8
High-temperature creep properties of a novel solder materia..:
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
11
Micro-cantilever Bending Test of Sintered Cu nanoparticles ..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
13
Low Temperature Fine Pitch All-Copper Interconnects Combini..:
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IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society ,
14