Jalar, Azman
94  Ergebnisse:
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1

Ultrasonic Al Bond on Mo Back-Contact Layer of CIGS Solar P..:

Hamid, Sabarina Abdul ; Zulkifli, Muhammad Nubli ; Jalar, Azman...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  6 - p. 1123-1133 , 2024
 
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2

Titanium dioxide ion-sensitive extended gate field effect t..:

Al-Hardan, Naif H. ; Hamid, Muhammad Azmi Abdul ; Firdaus-Raih, Mohd...
Journal of Materials Science: Materials in Electronics.  35 (2024)  5 - p. , 2024
 
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3

Linear growth behaviour of intermetallic compound layer in ..:

Bakar, Maria Abu ; Jalar, Azman ; Alias, Anuar
Science and Technology of Welding and Joining.  29 (2024)  1 - p. 38-46 , 2024
 
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4

Laser Rework Process for Efficient Lead-Free Solder Joints ..:

Ismail, Adlil Aizat ; Abu Bakar, Maria ; Jalar, Azman...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  4 - p. 735-742 , 2024
 
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5

Undissolved gold in fine-pitch BGA solder joint under therm..:

Ismail, Adlil Aizat ; Abu Bakar, Maria ; Jalar, Azman...
Journal of Materials Science: Materials in Electronics.  35 (2024)  12 - p. , 2024
 
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6

Effect of ultrasonic bonding and lamination on electrical p..:

Basher, Hassan ; Zulkifli, Muhammad Nubli ; Jalar, Azman.
Journal of Adhesion Science and Technology.  38 (2024)  14 - p. 2477-2496 , 2024
 
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8

Thermal Management on the Solder Joints of Adjacent Ball Gr..:

, In: Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium,
 
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10

Moisture Content and Early Corrosion Detection of Cu Wire B..:

Supramaniam, Saraswathy ; Bakar, Maria Abu ; Atiqah, A...
Journal of Failure Analysis and Prevention.  23 (2023)  6 - p. 2362-2369 , 2023
 
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11

Effect of Thermomechanical Treatment on Microstructural and..:

, In: Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium,
 
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12

Study on Forming and Properties of Heat Resistant Low Expan..:

, In: 2023 International Conference on Mechatronics, IoT and Industrial Informatics (ICMIII),
Li, Zhiyong ; Jalar, Azman - p. 292-296 , 2023
 
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13

Dynamic precipitation and dynamic recrystallization behavio..:

Wang, Linghao ; Jalar, Azman ; Dan, Longhong
Journal of Materials Research and Technology.  26 (2023)  - p. 7634-7648 , 2023
 
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14

Effect of Ultrasonic Process Parameter on Resistance and Pl..:

, In: TENCON 2023 - 2023 IEEE Region 10 Conference (TENCON),
 
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