Knickerbocker, John U.
85  Ergebnisse:
?
1

Heterogeneous Integration Technology Demonstrations for Fut..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Knickerbocker, John U. ; Budd, R. ; Dang, B.... - p. 1519-1528 , 2018
 
?
3

Development of vacuum underfill technology for a 3D chip st..:

Sakuma, Katsuyuki ; Kohara, Sayuri ; Sueoka, Kuniaki...
Journal of Micromechanics and Microengineering.  21 (2011)  3 - p. 035024 , 2011
 
1-15