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Smet, Vanessa
48  Ergebnisse:
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1

A Study of Chip-Package Interaction with All-Copper Interco..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Sosa, Ramon A. ; Surillo, Emanuel Torres ; Molina-Mangual, Christian. - p. 1841-1847 , 2024
Link: https://doi.org/10.1109/..
 
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2

Bayesian Optimization of Large Glass Package Architecture f..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Surillo, Emanuel Torres ; Sosa, Ramon A. ; Molina, Christian... - p. 246-253 , 2024
Link: https://doi.org/10.1109/..
 
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3

Mitigating Cracking from RDL Stress in Glass Substrates wit..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Molina-Mangual, Christian ; Surillo, Emanuel Torres ; Nedumthakady, Nithin. - p. 1552-1557 , 2024
Link: https://doi.org/10.1109/..
 
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4

Vanadium-Dioxide-Based Reconfigurable Ka-Band Dual-Sense Li..:

Lust, Mark S. ; West, David L. ; Smet, Vanessa..
IEEE Transactions on Antennas and Propagation.  72 (2024)  3 - p. 2468-2480 , 2024
Link: https://doi.org/10.1109/..
 
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5

Impact of Non-Coplanarities on Microstructure and Propertie..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Amirnasiri, Ali ; Sosa, Ramon A. ; Tian, Mengkun.. - p. 2298-2303 , 2024
Link: https://doi.org/10.1109/..
 
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6

Enabling Socketable BGAs with Eutectic-Forming Bi-based Coa..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Jaewon ; Smet, Vanessa - p. 1137-1143 , 2024
Link: https://doi.org/10.1109/..
 
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7

Magneto-Assisted Graphene Reinforcement: A New Method to En..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Nedumthakady, Nithin ; Bhaskar, Pragna ; Smet, Vanessa - p. 1135-1142 , 2023
Link: https://doi.org/10.1109/..
 
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8

A Multi-Objective, Machine-Learning-Based Optimization Meth..:

, In: 2023 IEEE Transportation Electrification Conference & Expo (ITEC),
Molina-Mangual, Christian ; Torres-Surillo, Emanuel ; Wong, Ryan. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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9

Intelligent Multi-Physics Design of 3-D Leadframe- based Si..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Torres-Surillo, Emanuel ; Molina-Mangual, Christian ; Smet, Vanessa - p. 1952-1958 , 2023
Link: https://doi.org/10.1109/..
 
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10

Anomalous evolution of topology in nanoporous copper under ..:

Shahane, Ninad ; Mohan, Kashyap ; Smet, Vanessa.
Materialia.  28 (2023)  - p. 101757 , 2023
Link: https://doi.org/10.1016/..
 
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11

High Performance, Multilayer Copper-Graphene Micro-Foam Wic..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Moss, Alex ; Antoniou, Antonia ; Smet, Vanessa - p. 2087-2092 , 2023
Link: https://doi.org/10.1109/..
 
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12

Reliability and Failure Analysis of Chip-to-Substrate Cu-Pi..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sosa, Ramon A. ; Antoniou, Antonia ; Smet, Vanessa - p. 318-323 , 2023
Link: https://doi.org/10.1109/..
 
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13

Demonstration of Glass-based 3D Package Architectures with ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Ravichandran, Siddharth ; Smet, Vanessa ; Swaminathan, Madhavan. - p. 1114-1120 , 2022
Link: https://doi.org/10.1109/..
 
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14

Compact SiC Power Module With Integrated Power Delivery and..:

Muslu, Ahmet Mete ; Smet, Vanessa ; Joshi, Yogendra
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  12 - p. 1939-1948 , 2022
Link: https://doi.org/10.1109/..
 
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15

Modeling and Design for System-Level Reliability and Warpag..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Jayaram, Vidya ; Gupte, Omkar ; Smet, Vanessa - p. 1060-1067 , 2022
Link: https://doi.org/10.1109/..
 
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