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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
11
Influence of voids in solder layer on the reliability of th..:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
13
Study on Reflow Warpage Deformation of High Pin Density BGA..:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
14