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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Fine Pitch and Low Temperature Nanocrystalline-Nanotwinned ..:
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2024 International Conference on Green Energy, Computing and Sustainable Technology (GECOST) ,
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Vision-Based Automated Parking Monitoring Using Geo-Tagged ..:
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Intelligent Systems Design and Applications; Lecture Notes in Networks and Systems ,
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Construct Alpha Factors in Cryptocurrency Market:
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2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB) ,
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Home Fire Alarm Prevention System:
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2024 IEEE International Reliability Physics Symposium (IRPS) ,
5
Machine Vision Observation, Artificial Intelligence Pattern..:
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ACM SIGGRAPH 2024 Immersive Pavilion ,
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FlowZen: Using Hybrid-Haptic and Particle for Enhancing Imm..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
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Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocry..:
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2024 International Conference on Electronics Packaging (ICEP) ,
8
The Enhancement in the Reliability of Nanotwinned Cu Redist..:
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2024 IEEE International Symposium on Circuits and Systems (ISCAS) ,
9
A Programmable CMOS Dielectrophoresis Array Chip with 128 ×..:
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2024 IEEE International Conference on Robotics and Automation (ICRA) ,
10
Probabilistic 3D Multi-Object Cooperative Tracking for Auto..:
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2024 International Wireless Communications and Mobile Computing (IWCMC) ,
11
On Poisoning Attacks and Defenses for LSTM Time Series Pred..:
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Companion Publication of the 2024 ACM Designing Interactive Systems Conference ,
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Re.Dis.Cover Place with Generative AI: Exploring the Experi..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
13
Signal Integrity Designs at Organic Interposer CoWoS-R for ..:
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2024 International Conference on Electronics Packaging (ICEP) ,
14
Optimal Impedance Design for Meshed Ground Application at H..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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