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Hung Yi-Jun
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1

Fine Pitch and Low Temperature Nanocrystalline-Nanotwinned ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chiu, Wei-Lan ; Lee, Ou-Hsiang ; Chang, Hsiang-Hung... - p. 319-324 , 2024
Link: https://doi.org/10.1109/..
 
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2

Vision-Based Automated Parking Monitoring Using Geo-Tagged ..:

, In: 2024 International Conference on Green Energy, Computing and Sustainable Technology (GECOST),
Lai, Chung Yi ; Jo, Hudyjaya Siswoyo ; Lai, Chean Hung. - p. 136-140 , 2024
Link: https://doi.org/10.1109/..
 
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3

Construct Alpha Factors in Cryptocurrency Market:

, In: Intelligent Systems Design and Applications; Lecture Notes in Networks and Systems,
Wu, Mu-En ; Chiang, Yu-Hung ; Huang, Jun-Lin. - p. 414-417 , 2024
Link: https://doi.org/10.1007/..
 
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4

Home Fire Alarm Prevention System:

, In: 2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB),
Lin, Wei-Chuan ; Liu, Yi ; Hsu, Chan-Hua.. - p. 450-454 , 2024
Link: https://doi.org/10.1109/..
 
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5

Machine Vision Observation, Artificial Intelligence Pattern..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Chen, Cheng-Shan ; Yang, Chun-Yen ; Yang, Shao-Jui... - p. 10B.5-1-10B.5-7 , 2024
Link: https://doi.org/10.1109/..
 
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6

FlowZen: Using Hybrid-Haptic and Particle for Enhancing Imm..:

, In: ACM SIGGRAPH 2024 Immersive Pavilion,
Chen, Yang-Sheng ; Theodore, Grace ; Huang, Jing-Yuan... - p. 1-2 , 2024
Link: https://dl.acm.org/doi/1..
 
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7

Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocry..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lin, Ang-Ying ; Lin, Yu-Min ; Lu, Chun-Lin... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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8

The Enhancement in the Reliability of Nanotwinned Cu Redist..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hung, Yu-Wen ; Lin, Yi-Quan ; Chen, Chih - p. 103-104 , 2024
Link: https://doi.org/10.23919..
 
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9

A Programmable CMOS Dielectrophoresis Array Chip with 128 ×..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Lin, Wen-Yue ; Lai, Lin-Hung ; Lin, Yi-Wei. - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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10

Probabilistic 3D Multi-Object Cooperative Tracking for Auto..:

, In: 2024 IEEE International Conference on Robotics and Automation (ICRA),
Chiu, Hsu-Kuang ; Wang, Chien-Yi ; Chen, Min-Hung. - p. 18458-18464 , 2024
Link: https://doi.org/10.1109/..
 
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11

On Poisoning Attacks and Defenses for LSTM Time Series Pred..:

, In: 2024 International Wireless Communications and Mobile Computing (IWCMC),
Chen, Yi-Yu ; Hung, Hui-Nien ; Yang, Shun-Ren.. - p. 610-615 , 2024
Link: https://doi.org/10.1109/..
 
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12

Re.Dis.Cover Place with Generative AI: Exploring the Experi..:

, In: Companion Publication of the 2024 ACM Designing Interactive Systems Conference,
Hung, Peng-Kai ; Huang, Janet Yi-Ching ; Wensveen, Stephan. - p. 219-223 , 2024
Link: https://dl.acm.org/doi/1..
 
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13

Signal Integrity Designs at Organic Interposer CoWoS-R for ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yang, Sheng-Fan ; Wang, Wei-Chiao ; Lin, Yi-Tzeng... - p. 1098-1103 , 2024
Link: https://doi.org/10.1109/..
 
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14

Optimal Impedance Design for Meshed Ground Application at H..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hung, Shin-Yi ; Wu, Sung-Mao - p. 295-296 , 2024
Link: https://doi.org/10.23919..
 
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15

A Novel Detection Applied on Micro Defect in Bump Interface..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Yi-Sheng ; Hsiao, Yu-Hsiang ; Liu, Cheng-Hsin... - p. 1804-1807 , 2024
Link: https://doi.org/10.1109/..
 
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