Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Chu, Anne H.Y.
89  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
?
1

List of contributors:

, In: Feldman and Pike' s Vitamin D,
Adams, John S. ; Amrein, Karin ; Anderson, Paul H.... - p. xxvii-xxxiv , 2024
Link: https://doi.org/10.1016/..
 
?
2

Automatic Verbalizer for Extracting Fine-Grained Customer O..:

, In: HCI International 2024 Posters; Communications in Computer and Information Science,
Chu, Carlin C. F. ; Leung, Jonathan H. Y. ; So, Raymond. - p. 23-32 , 2024
Link: https://doi.org/10.1007/..
 
?
3

Translation Rate Prediction and Regulatory Motif Discovery ..:

, In: Lecture Notes in Computer Science; Research in Computational Molecular Biology,
Zheng, Weizhong ; Fong, John H. C. ; Wan, Yuk Kei... - p. 139-154 , 2023
Link: https://doi.org/10.1007/..
 
?
4

Remote mass facial temperature screening in varying ambient..:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition Workshops (CVPRW),
Qiu, Chu Chu ; Wei Chin, Jing ; Wong, Kwan Long... - p. 6068-6076 , 2023
Link: https://doi.org/10.1109/..
 
?
5

List of contributors:

, In: Synthetic and Natural Nanofillers in Polymer Composites,
Abdullah, N. ; Abdul Saad, Wan Aliff ; Ahmad, Muhammad Zamharir... - p. xiii-xviii , 2023
Link: https://doi.org/10.1016/..
 
?
6

Efficient data management in edge computing:

, In: IET International Conference on Engineering Technologies and Applications (ICETA 2023),
Chen, S. -Y. ; Chen, H. -M. ; Chu, C. -Y. - p. None , 2023
Link: https://doi.org/10.1049/..
 
?
7

Airgap Integration on Patterned Metal Lines for Advanced In..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
Chang, H.K. ; Huang, H.Y. ; Lo, T.Y... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
?
8

Characterizing International Biomarker Standardization Init..:

, In: 2023 19th International Symposium on Medical Information Processing and Analysis (SIPAIM),
Sweetland, Katharine ; Chu, Karen ; Lei, Xiaomeng... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
?
9

Intel PowerVia Technology: Backside Power Delivery for High..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Hafez, W. ; Agnihotri, P. ; Asoro, M.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
?
10

Legged Robot Running on Rough Terrains Based on Norm Regula..:

, In: 2023 IEEE-RAS 22nd International Conference on Humanoid Robots (Humanoids),
David Lo, C. H. ; Giselle Wong, C. Y. ; Ng, Wee Shen... - p. 1-8 , 2023
Link: https://doi.org/10.1109/..
 
?
11

Effects of Reconstruction Filter Kernels in Computed Tomogr..:

, In: 2023 19th International Symposium on Medical Information Processing and Analysis (SIPAIM),
Sweetland, Katharine ; Chu, Karen ; Lei, Xiaomeng... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
?
12

Performing Machine Learning Based Outlier Detection for Aut..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Yang, Y.L. ; Tsao, P.C. ; Lin, C.W.... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
?
13

Mechanical behaviour of TA2 titanium under dynamic uniaxial..:

, In: 1st International Conference on Mechanical System Dynamics (ICMSD 2022),
Chu, Z. ; Zhang, Y. ; Gan, Y.... - p. None , 2022
Link: https://doi.org/10.1049/..
 
?
14

Intel 4 CMOS Technology Featuring Advanced FinFET Transisto..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Sell, B. ; An, S. ; Armstrong, J.... - p. 282-283 , 2022
Link: https://doi.org/10.1109/..
 
?
15

A 112.5Gb/s ADC-DSP-Based PAM-4 Long-Reach Transceiver with..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Guo, Z. ; Mostafa, A. ; Elshazly, A.... - p. 116-118 , 2022
Link: https://doi.org/10.1109/..
 
1-15