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Chung, Dai-Jung
56  Ergebnisse:
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1

Advanced Fan-Out Embedded Chip Process Integration for 3D A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsiao, Chih-Cheng ; Hsu, Chao-Kai ; Li, Ching-Iang... - p. 181-182 , 2024
Link: https://doi.org/10.23919..
 
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2

Using Graph Neural Network to Ransomware Detection for Cybe..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Lin, Hsiao-Chung ; Wang, Ping ; Lin, Wen-Hui... - p. 314-316 , 2024
Link: https://doi.org/10.1109/..
 
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3

Layout Guidelines against Charging Damage from the Well-Sid..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Kuo, Hsi-Yu ; Chu, Yu-Lin ; Dai, Hung-Da... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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4

List of contributors:

, In: Water Security: Big Data-Driven Risk Identification, Assessment and Control of Emerging Contaminants,
Abdelkarim, Esraa A. ; Ali, Sameh S. ; Al-Tohamy, Rania... - p. xvii-xxiv , 2024
Link: https://doi.org/10.1016/..
 
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5

NTIRE 2023 Challenge on Efficient Super-Resolution: Methods..:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition Workshops (CVPRW),
Li, Yawei ; Zhang, Yulun ; Timofte, Radu... - p. 1922-1960 , 2023
Link: https://doi.org/10.1109/..
 
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6

Protection Schemes for Plasma Induced Damage from Well-Side..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Kuo, Hsi-Yu ; Chu, Yu-Lin ; Dai, Hung-Da... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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7

Beyond Static Parallel Loops: Supporting Dynamic Task Paral..:

, In: Proceedings of the 28th ACM International Conference on Architectural Support for Programming Languages and Operating Systems, Volume 3,
Cheng, Lin ; Ruttenberg, Max ; Jung, Dai Cheol... - p. 46-58 , 2023
Link: https://dl.acm.org/doi/1..
 
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8

An Origami-Inspired Deployable Space Debris Collector:

, In: 2023 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS),
Tanaka, Yuto ; Anibha, Aditya Arjun ; Jung, Leonard... - p. 10757-10762 , 2023
Link: https://doi.org/10.1109/..
 
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9

Highly Reliable, Scalable, and High-Yield HfZrOx FRAM by Ba..:

, In: 2022 International Electron Devices Meeting (IEDM),
Lin, Yu-De ; Yeh, Po-Chun ; Dai, Jheng-Yang... - p. 32.1.1-32.1.4 , 2022
Link: https://doi.org/10.1109/..
 
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10

An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-P..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Zhang, Jie ; Lu, Wei ; Huang, Po-Tsang... - p. 262-263 , 2022
Link: https://doi.org/10.1109/..
 
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11

COVID-19 Infection Percentage Prediction via Boosted Hierar..:

, In: Lecture Notes in Computer Science; Image Analysis and Processing. ICIAP 2022 Workshops,
Hsu, Chih-Chung ; Dai, Sheng-Jay ; Chen, Shao-Ning - p. 529-535 , 2022
Link: https://doi.org/10.1007/..
 
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12

Correction to: Introduction to Homomorphic Encryption and S..:

, In: Protecting Privacy through Homomorphic Encryption,
Cheon, Jung Hee ; Costache, Anamaria ; Moreno, Radames Cruz... - p. C1-C1 , 2022
Link: https://doi.org/10.1007/..
 
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13

Stochastic-Gradient-Descent-Based Max-Margin Early Event De..:

, In: Communications in Computer and Information Science; New Trends in Computer Technologies and Applications,
Wang, Hong-Wen ; Chiu, Dai-Yi ; Chan, Wei-Chung. - p. 545-552 , 2022
Link: https://doi.org/10.1007/..
 
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14

Evaluating the usage of Text-To-Speech in K12 education:

, In: Proceedings of the 2022 6th International Conference on Education and E-Learning,
Dai, Laduona ; Kritskaia, Veronika ; van der Velden, Evelien... - p. 182-188 , 2022
Link: https://dl.acm.org/doi/1..
 
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15

Demo: Real-Time Semantic Communications with a Vision Trans..:

, In: 2022 IEEE International Conference on Communications Workshops (ICC Workshops),
Yoo, Hanju ; Jung, Taehun ; Dai, Linglong.. - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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