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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
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34.8 A 22nm 16Mb Floating-Point ReRAM Compute-in-Memory Mac..:
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Methods and Applications of Geochronology ,
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A method and application for the integration of geology, ge..:
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2024 10th International Conference on Applied System Innovation (ICASI) ,
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Sidelobe Level Reduction in Uniform Planar Phased Arrays Th..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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Advanced Fan-Out Embedded Chip Process Integration for 3D A..:
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2024 10th International Conference on Applied System Innovation (ICASI) ,
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A Soft-Switching Single-Phase Two-Arm Unified Power Quality..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
6
Fine Pitch and Low Temperature Nanocrystalline-Nanotwinned ..:
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2024 IEEE/MTT-S International Microwave Symposium - IMS 2024 ,
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Design and Analysis of SPDT Switch and Array Antenna for 28..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
8
Thermal resistance prediction model for IC packaging optimi..:
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Springer Proceedings in Physics; Proceedings of the 8th International Conference on Space Science and Communication ,
10
Exploration of Wi-Fi-Based Indoor Positioning System Using ..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
12
Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
13
Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:
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2024 IEEE 7th Eurasian Conference on Educational Innovation (ECEI) ,
14
Scaled Component Models for Wind Farm Power Analysis Based ..:
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2024 IEEE International Reliability Physics Symposium (IRPS) ,
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