E-LIB Suche - Ergebnisse für: Chung, Pei-Chin

1

34.8 A 22nm 16Mb Floating-Point ReRAM Compute-in-Memory Mac..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),

Wen, Tai-Hao ; Hsu, Hung-Hsi ; Khwa, Win-San... - p. 580-582 , 2024

Link: https://doi.org/10.1109/..

2

A method and application for the integration of geology, ge..:

, In: Methods and Applications of Geochronology,

Chang, Su-Chin ; Pei, Rui ; Wang, Jun. - p. 445-477 , 2024

Link: https://doi.org/10.1016/..

3

Sidelobe Level Reduction in Uniform Planar Phased Arrays Th..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),

Huang, Chung-Hao ; Xu, Chao-Chin ; Lee, Jin-Cheng. - p. 1-3 , 2024

Link: https://doi.org/10.1109/..

4

Advanced Fan-Out Embedded Chip Process Integration for 3D A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Hsiao, Chih-Cheng ; Hsu, Chao-Kai ; Li, Ching-Iang... - p. 181-182 , 2024

Link: https://doi.org/10.23919..

5

A Soft-Switching Single-Phase Two-Arm Unified Power Quality..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),

Jiang, Maoh-Chin ; Liu, Tai Chun ; Lin, Chung His - p. 181-183 , 2024

Link: https://doi.org/10.1109/..

6

Fine Pitch and Low Temperature Nanocrystalline-Nanotwinned ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Chiu, Wei-Lan ; Lee, Ou-Hsiang ; Chang, Hsiang-Hung... - p. 319-324 , 2024

Link: https://doi.org/10.1109/..

7

Design and Analysis of SPDT Switch and Array Antenna for 28..:

, In: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024,

Huang, Chung-Ta ; Lin, Yo-Sheng ; Huang, Chin-Yi. - p. 757-759 , 2024

Link: https://doi.org/10.1109/..

8

Thermal resistance prediction model for IC packaging optimi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Chen, Guan-Wei ; Lin, Yan-Cheng ; Hsu, Chung-Hsiang... - p. 1593-1598 , 2024

Link: https://doi.org/10.1109/..

9

Contributors:

, In: Methods and Applications of Geochronology,

Assis Fernandes, Vera ; Burgess, Ray ; Camacho, Alfredo... - p. xiii-xv , 2024

Link: https://doi.org/10.1016/..

10

Exploration of Wi-Fi-Based Indoor Positioning System Using ..:

, In: Springer Proceedings in Physics; Proceedings of the 8th International Conference on Space Science and Communication,

Barakat, Mohtady Ehab Hasan Aly ; Chung, Gwo Chin ; Pang, Wai Leong... - p. 383-392 , 2024

Link: https://doi.org/10.1007/..

11

Exploring the Application of Multi-Sensory Device Interacti..:

, In: ACM SIGGRAPH 2024 Posters,

Chen, Chin-Chun ; Yang, Tung-Hua ; Yang, Cheng-Ta... - p. 1-2 , 2024

Link: https://dl.acm.org/doi/1..

12

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),

Ouyang, Tsung- Yu ; Lin, Yu-Min ; Chan, Yu-Ping... - p. 1-2 , 2024

Link: https://doi.org/10.1109/..

13

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024

Link: https://doi.org/10.1109/..

14

Scaled Component Models for Wind Farm Power Analysis Based ..:

, In: 2024 IEEE 7th Eurasian Conference on Educational Innovation (ECEI),

Chung, I-Hua ; Zhang, Ming-Jun ; Chu, Chin-Pao - p. 399-404 , 2024

Link: https://doi.org/10.1109/..

15

Embedded Deep-Nwell Collector Used to Improve Latch-Up Immu..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),

Hsu, Chen-Wei ; Ker, Ming-Dou ; Chung, Ping-Lin.. - p. 1-4 , 2024

Link: https://doi.org/10.1109/..