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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
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6.10 A 1/1.56-inch 50Mpixel CMOS Image Sensor with 0.5μm pi..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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High Performance 3D Package Technology for Mobile Applicati..:
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2024 International Conference on Electronics, Information, and Communication (ICEIC) ,
3
Comparison of Electrical Characteristics Between SiC and Si..:
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2024 IEEE International Conference on Advanced Robotics and Its Social Impacts (ARSO) ,
4
DAIM-HRI: A new Human-Robot Integration Technology for Indu..:
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Proceedings of the 25th Annual International Conference on Digital Government Research ,
5
Data-driven insights: Redefining organizational culture mea..:
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2024 18th International Conference on Ubiquitous Information Management and Communication (IMCOM) ,
6
Emotional Subtitles Through Speech in Films: A Case Study:
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2024 IEEE International Magnetic Conference - Short papers (INTERMAG Short papers) ,
7
Drag Force Analysis of Superconducting EDS Type Hyperloop S..:
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2024 IEEE Custom Integrated Circuits Conference (CICC) ,
8
SP-IMC: A Sparsity Aware In-Memory-Computing Macro in 28nm ..:
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Proceedings of the 29th ACM International Conference on Architectural Support for Programming Languages and Operating Systems, Volume 3 ,
9
IANUS: Integrated Accelerator based on NPU-PIM Unified Memo..:
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2024 International Conference on Electronics Packaging (ICEP) ,
10
Eutectic Bonding in Sequential Bi and Sn Layers for Low-Tem..:
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2024 IEEE International Conference on Big Data and Smart Computing (BigComp) ,
11
Inclusive User Experience Design for Older Adults: Focusing..:
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2024 International Conference on Electronics, Information, and Communication (ICEIC) ,
13
BDA: Blockchain-Based Decentralized Authentication System f..:
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Advances in Knowledge Discovery and Data Mining; Lecture Notes in Computer Science ,
14
Multi-time Window Ensemble and Maximization of Expected Ret..:
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2024 International Conference on Electronics, Information, and Communication (ICEIC) ,
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