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Jeong, Myeong Gon
27  Ergebnisse:
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1

13.4 A 48GB 16-High 1280GB/s HBM3E DRAM with All-Around Pow..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lee, Jinhyung ; Cho, Kyungjun ; Lee, Chang Kwon... - p. 238-240 , 2024
Link: https://doi.org/10.1109/..
 
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2

Contributors:

, In: Advances in Electronic Materials for Clean Energy Conversion and Storage Applications,
Ahmad, Rafiq ; Ahmad, Akil ; Ahmad, Irshad... - p. xiii-xviii , 2023
Link: https://doi.org/10.1016/..
 
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3

Enhancing Drivers' Perception of Traffic Lights through Hap..:

, In: 2023 IEEE 6th International Conference on Knowledge Innovation and Invention (ICKII),
Jeong, Chanyeong ; Kim, Eugene ; Hwang, Myeong-Hwan. - p. 131-135 , 2023
Link: https://doi.org/10.1109/..
 
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4

Thermal Management in Multi-Finger GaN-on-Si HEMTs: Underst..:

, In: 2023 International Electron Devices Meeting (IEDM),
Jeong, Jaeyong ; Choi, Sung Joon ; Shim, Joonsup... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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5

Efficient and Accurate Quantized Image Super-Resolution on ..:

, In: Lecture Notes in Computer Science; Computer Vision – ECCV 2022 Workshops,
Ignatov, Andrey ; Timofte, Radu ; Denna, Maurizio... - p. 92-129 , 2023
Link: https://doi.org/10.1007/..
 
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6

Smart tourism chatbot system using Multi-domain Tourism Inf..:

, In: 2023 Fourteenth International Conference on Ubiquitous and Future Networks (ICUFN),
Kang, Hoon-Chul ; Kang, Ki-Beom ; Kim, Dong-Hyun... - p. 608-612 , 2023
Link: https://doi.org/10.1109/..
 
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7

Fully CMOS-Compatible Room-Temperature Waveguide-Integrated..:

, In: 2023 International Electron Devices Meeting (IEDM),
Shim, Joonsup ; Lim, Jinha ; Kim, Inki... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

IL Scavenging and Recovery Strategies to Improve the Perfor..:

, In: 2023 International Electron Devices Meeting (IEDM),
Kim, Bong Ho ; Kim, Seong Kwang ; Kuk, Song-hyeon... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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9

Advances in the large-scale production, fabrication, stabil..:

, In: Advances in Electronic Materials for Clean Energy Conversion and Storage Applications,
Seo, Seong Kuk ; Jeong, Myeong Hoon ; Kim, Chan Ul - p. 27-60 , 2023
Link: https://doi.org/10.1016/..
 
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10

A sub-micron-thick InGaAs broadband (400-1700 nm) photodete..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Geum, Dae-Myeong ; Lim, Jinha ; Jang, Junho... - p. 413-414 , 2022
Link: https://doi.org/10.1109/..
 
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11

Association of Weight Change with Risk of Primary Liver Can..:

, In: 2022 IEEE/ACIS 7th International Conference on Big Data, Cloud Computing, and Data Science (BCD),
Yoon, Sung Soo ; Lee, Sang Jun ; Kim, Hye Jun... - p. 327-331 , 2022
Link: https://doi.org/10.1109/..
 
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12

3D stackable cryogenic InGaAs HEMTs for heterogeneous and m..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Jeong, Jaeyong ; Kwang Kim, Seong ; Kim, Jongmin... - p. 328-329 , 2022
Link: https://doi.org/10.1109/..
 
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13

Temporal-Invariant Video Representation Learning with Dynam..:

, In: 2022 18th IEEE International Conference on Advanced Video and Signal Based Surveillance (AVSS),
Jeong, Seong-Yun ; Kim, Ho-Joong ; Oh, Myeong-Seok.. - p. 1-8 , 2022
Link: https://doi.org/10.1109/..
 
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14

3D Stackable Cryogenic InGaAs HEMT-Based DC and RF Multiple..:

, In: 2022 International Electron Devices Meeting (IEDM),
Jeong, Jaeyong ; Kim, Seong Kwang ; Kim, Jongmin... - p. 4.5.1-4.5.4 , 2022
Link: https://doi.org/10.1109/..
 
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15

A Study of Electrostatic Induced Voltage between the Contac..:

, In: 2022 6th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST),
Choi, Myeong-Seob ; Kim, Jeong-Hoon ; Park, Chan-Sol.. - p. 226-228 , 2022
Link: https://doi.org/10.1109/..
 
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