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2024 IEEE International Conference on Big Data and Smart Computing (BigComp) ,
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MoCVAE: Movement Prediction by A Conditional Variational Au..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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A Study on the Surface Activation of Plasma Treatment for H..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
3
High Acceleration Dynamic Methodology for Board-Level Shock..:
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2024 6th Global Power, Energy and Communication Conference (GPECOM) ,
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State of Charge Estimation and Circuit Implementation for L..:
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2024 IEEE International Symposium on Circuits and Systems (ISCAS) ,
5
Low DRAM Memory Access and Flexible Dataflow Convolutional ..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
6
A Leakage Analysis Methodology Considering Intra-Cell and I..:
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Proceedings of the 10th Hydrogen Technology Convention, Volume 1; Springer Proceedings in Physics ,
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High Efficiency Fuel Cell Stack and Key Technologies of Pow..:
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2024 IEEE International Reliability Physics Symposium (IRPS) ,
8
Reliability Assessment for an In-3D-NAND Approximate Search..:
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2024 International Conference on Electronics Packaging (ICEP) ,
9
Preparation and Characterization of Expanded Graphite/Polym..:
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2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) ,
10
Hydrothermally Grown Ferroelectric Film-based Flexible Sens..:
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2024 IEEE International Memory Workshop (IMW) ,
11
3D-NAND based Filtering Cube with High Resolution 2D Query ..:
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2024 IEEE International Symposium on Circuits and Systems (ISCAS) ,
12
CIMR-V: An End-to-End SRAM-based CIM Accelerator with RISC-..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
13
15.9 A 16nm 16Mb Embedded STT-MRAM with a 20ns Write Time, ..:
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2024 International Conference on Electronics Packaging (ICEP) ,
14
Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:
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Computer Security – ESORICS 2023; Lecture Notes in Computer Science ,
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