Lai, Chih-Feng
343  Ergebnisse:
Personensuche X
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1

MoCVAE: Movement Prediction by A Conditional Variational Au..:

, In: 2024 IEEE International Conference on Big Data and Smart Computing (BigComp),
Sung, Pei-Chieh ; Lai, Hsu-Chao ; Jhang, Guan-Yi... - p. 40-47 , 2024
 
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2

A Study on the Surface Activation of Plasma Treatment for H..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hsu, Chih-Jing ; Fang, Hsu-Nan ; Su, Tzu-Yu... - p. 1826-1829 , 2024
 
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3

High Acceleration Dynamic Methodology for Board-Level Shock..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yu, Min-Cheng ; Wu, Nan-Yi ; Wang, Wu-Lung... - p. 1213-1218 , 2024
 
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4

State of Charge Estimation and Circuit Implementation for L..:

, In: 2024 6th Global Power, Energy and Communication Conference (GPECOM),
Ou, Yang-Chieh ; Shiue, Muh-Tian ; Liu, Bing-Jun... - p. 98-102 , 2024
 
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5

Low DRAM Memory Access and Flexible Dataflow Convolutional ..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Chen, Yi-Fan ; Chang, Yu-Jen ; Chiu, Ching-Te... - p. 1-5 , 2024
 
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6

A Leakage Analysis Methodology Considering Intra-Cell and I..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Xu, Jiayi ; Tsai, Chia-Yu ; Huang, Heng-Liang... - p. 1-4 , 2024
 
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7

High Efficiency Fuel Cell Stack and Key Technologies of Pow..:

, In: Proceedings of the 10th Hydrogen Technology Convention, Volume 1; Springer Proceedings in Physics,
Hsu, Che-Jung ; Lin, Cheng-Huei ; Lee, Chih-Hung.. - p. 422-428 , 2024
 
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8

Reliability Assessment for an In-3D-NAND Approximate Search..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Tseng, Po-Hao ; Lin, Yu-Hsuan ; Lee, Feng-Min... - p. 1-6 , 2024
 
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9

Preparation and Characterization of Expanded Graphite/Polym..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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10

Hydrothermally Grown Ferroelectric Film-based Flexible Sens..:

, In: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS),
Feng, Guo-Hua ; Yeh, Chih-Ting - p. 1-4 , 2024
 
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11

3D-NAND based Filtering Cube with High Resolution 2D Query ..:

, In: 2024 IEEE International Memory Workshop (IMW),
Tseng, Po-Hao ; Fang, Shao-Yu ; Lin, Yu-Hsuan... - p. 1-4 , 2024
 
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12

CIMR-V: An End-to-End SRAM-based CIM Accelerator with RISC-..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
 
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13

15.9 A 16nm 16Mb Embedded STT-MRAM with a 20ns Write Time, ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lin, Ku-Feng ; Noguchi, Hiroki ; Shih, Yi-Chun... - p. 292-294 , 2024
 
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14

Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Yang, Hung-Chun ; Lai, Wei-Hong ; Kao, Chin-Li.. - p. 151-152 , 2024
 
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15

Committed Private Information Retrieval:

, In: Computer Security – ESORICS 2023; Lecture Notes in Computer Science,
Cao, Quang ; Tran, Hong Yen ; Dau, Son Hoang... - p. 393-413 , 2024
 
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