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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023 ,
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Physical and Numerical Simulations of Heavy Oil Recovery Th..:
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Lecture Notes in Electrical Engineering; The Proceedings of the 18th Annual Conference of China Electrotechnical Society ,
2
Plasma Surface Modification to Reduce Interfacial Defects i..:
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2024 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) ,
3
A 24–30 GHz GaN Front-End MMIC with Coupled-Resonator based..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
4
31.4 98.7% Efficiency 1200V-to-48V LLC Converter with CC/CV..:
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2024 36th Chinese Control and Decision Conference (CCDC) ,
5
An Improved Iterated Greedy Algorithm for Distributed Permu..:
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2024 36th Chinese Control and Decision Conference (CCDC) ,
6
An Improved Multi-Objective Iterated Greedy Algorithm for E..:
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Proceedings of the Fourteenth ACM Conference on Data and Application Security and Privacy ,
7
A-COPILOT: Android Covert Operation for Private Information..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023 ,
8
Synthesis and Application of High Temperature Resistant Sol..:
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Proceedings of International Conference on Image, Vision and Intelligent Systems 2023 (ICIVIS 2023); Lecture Notes in Electrical Engineering ,
9
Research on the Development of Graphical Modeling and Visua..:
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2024 8th International Conference on Control Engineering and Artificial Intelligence ,
10
A Knowledge-driven Framework for Software Supply Chain Secu..:
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Proceedings of the ACM on Web Conference 2024 ,
11
ReLLa: Retrieval-enhanced Large Language Models for Lifelon..:
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Companion Proceedings of the 32nd ACM International Conference on the Foundations of Software Engineering ,
12
Human-Imperceptible Retrieval Poisoning Attacks in LLM-Powe..:
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2024 IEEE Custom Integrated Circuits Conference (CICC) ,
13
A 128Gb/s PAM-4 Transmitter with Edge-Boosting Pulse Genera..:
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2024 International Conference on Electronics Packaging (ICEP) ,
14
The Effect of Electromigration and Stress Migration on NT-C..:
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Companion Proceedings of the 32nd ACM International Conference on the Foundations of Software Engineering ,
15
When Fuzzing Meets LLMs: Challenges and Opportunities:
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