Personensuche
X
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
High Acceleration Dynamic Methodology for Board-Level Shock..:
, In:
?
2024 IEEE International Conference on Consumer Electronics (ICCE) ,
2
10-point connector formed by two snap buttons:
, In:
?
2024 International Conference on Electronics Packaging (ICEP) ,
3
Solder Joint Reliability Comparison Under JEDEC Drop and Sy..:
, In:
?
2024 International Conference on Electronics Packaging (ICEP) ,
4
Large-Scale Cu Interconnection of Organic Substrate Materia..:
, In:
?
Communications in Computer and Information Science; Mobile Internet Security ,
5
A Heterogeneous Computing Framework for Accelerating Fully ..:
, In:
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
6
Ultra Thin Fan-Out 3D WLCSP Heterogeneous Integration Packa..:
, In:
?
2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
7
14.4 A Fully Digital Current Sensor Offering Per-Core Runti..:
, In:
?
2024 International Conference on Electronics Packaging (ICEP) ,
8
Semiconductor Fan-Out Polymer Adhesion on Physical Vapor De..:
, In:
?
2024 IEEE International Reliability Physics Symposium (IRPS) ,
9
Insight into Latchup Risk in 28nm Planar Bulk Technology fo..:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
10
Patch-type Flex SiP Platform for Heathcare Application:
, In:
?
2023 International Conference on Electronics Packaging (ICEP) ,
11
Enhanced Reactivity of Electroless Cu Interconnection by Su..:
, In:
?
Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems ,
12
Are You Killing Time? Predicting Smartphone Users' Time-kil..:
, In:
?
2023 IEEE International Solid- State Circuits Conference (ISSCC) ,
13
2.2 A 5G Mobile Gaming-Centric SoC with High-Performance Th..:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
14