Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
SHIH, Kao-Shang
95  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
?
1

High Acceleration Dynamic Methodology for Board-Level Shock..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yu, Min-Cheng ; Wu, Nan-Yi ; Wang, Wu-Lung... - p. 1213-1218 , 2024
Link: https://doi.org/10.1109/..
 
?
2

10-point connector formed by two snap buttons:

, In: 2024 IEEE International Conference on Consumer Electronics (ICCE),
Yang, Chang-Ming ; Wu, Shu-Cing ; Kao, Rally... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
?
3

Solder Joint Reliability Comparison Under JEDEC Drop and Sy..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Shih, Meng-Kai ; Ke, Zih-Jun ; Yen, Chun-Yu.. - p. 153-154 , 2024
Link: https://doi.org/10.23919..
 
?
4

Large-Scale Cu Interconnection of Organic Substrate Materia..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Shih, M. L. ; Shih, P. S. ; Huang, J. H.... - p. 1-2 , 2024
Link: https://doi.org/10.23919..
 
?
5

A Heterogeneous Computing Framework for Accelerating Fully ..:

, In: Communications in Computer and Information Science; Mobile Internet Security,
Shih, Cheng-Jhih ; Hung, Shih-Hao ; Chen, Ching-Wen... - p. 121-135 , 2024
Link: https://doi.org/10.1007/..
 
?
6

Ultra Thin Fan-Out 3D WLCSP Heterogeneous Integration Packa..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, Jay ; Zhang, Zen-Wei ; Lin, Vito... - p. 2107-2111 , 2024
Link: https://doi.org/10.1109/..
 
?
7

14.4 A Fully Digital Current Sensor Offering Per-Core Runti..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lu, Chien-Yu ; Huang, Bo-Jr ; Chen, Min-Chieh... - p. 260-262 , 2024
Link: https://doi.org/10.1109/..
 
?
8

Semiconductor Fan-Out Polymer Adhesion on Physical Vapor De..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lin, Nien-Chun ; Shih, Hsin-Chih ; Tsai, Ching-I... - p. 179-180 , 2024
Link: https://doi.org/10.23919..
 
?
9

Insight into Latchup Risk in 28nm Planar Bulk Technology fo..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Serbulova, Kateryna ; Qiu, Zi-En ; Chen, Shih-Hung... - p. 1-7 , 2024
Link: https://doi.org/10.1109/..
 
?
10

Patch-type Flex SiP Platform for Heathcare Application:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Ming-Hung ; Chang, Wei-Hao ; Jian, Hui-Ping... - p. 1438-1441 , 2023
Link: https://doi.org/10.1109/..
 
?
11

Enhanced Reactivity of Electroless Cu Interconnection by Su..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Lin, Y. C. ; Shen, C. H. ; Hung, C. Y.... - p. 147-148 , 2023
Link: https://doi.org/10.23919..
 
?
12

Are You Killing Time? Predicting Smartphone Users' Time-kil..:

, In: Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems,
Chen, Yu-Chun ; Lee, Yu-Jen ; Kao, Kuei-Chun... - p. 1-19 , 2023
Link: https://dl.acm.org/doi/1..
 
?
13

2.2 A 5G Mobile Gaming-Centric SoC with High-Performance Th..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Huang, Bo-Jr ; Tsai, Alfred ; Hsieh, Lear... - p. 40-42 , 2023
Link: https://doi.org/10.1109/..
 
?
14

A novel and simple method of low temperature, low process t..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Huang, Jeng-Hau ; Shih, Po-Shao ; Shen, Chang-Hsien... - p. 1660-1663 , 2023
Link: https://doi.org/10.1109/..
 
?
15

A Wearable Solution for Obstructive Sleep Apnea Risk Evalua..:

, In: 2023 IEEE SENSORS,
Wang, Chih Hao ; Lu, Shih Jen ; Chou, Yang Ming.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
1-15