Schaefer, Benjamin Carrion
51  Ergebnisse:
Personensuche X
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1

Investigating the Effect of Hyper-Parameter Settings on Sim..:

, In: 2024 IEEE 17th Dallas Circuits and Systems Conference (DCAS),
 
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2

VeriPy: A Python-Powered Framework for Parsing Verilog HDL ..:

, In: 2024 IEEE 17th Dallas Circuits and Systems Conference (DCAS),
 
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3

CERTIFY: AutomatiC MEasuRing The QualIty oF High-Level SYnt..:

, In: 2023 IEEE International Symposium on Circuits and Systems (ISCAS),
 
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4

Approximating HW Accelerators through Partial Extractions o..:

, In: Proceedings of the 28th Asia and South Pacific Design Automation Conference,
 
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5

ADVICE: Automatic Design and Optimization of Behavioral App..:

, In: Proceedings of the Great Lakes Symposium on VLSI 2023,
Si, Qilin ; Carrion Schaefer, Benjamin - p. 327-332 , 2023
 
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6

Contributors:

, In: Food Safety Management,
Adams, Martin R. ; Ahrné, Lilia ; Andersen, Veslemøy... - p. xxiii-xxv , 2023
 
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7

PEPA: Performance Enhancement of Embedded Processors throug..:

, In: Proceedings of the Great Lakes Symposium on VLSI 2023,
 
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8

MIRROR: MaxImizing the Re-usability of RTL thrOugh RTL to C..:

, In: 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE),
 
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9

MANTIS: Machine Learning-Based Approximate ModeliNg of Reda..:

, In: 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE),
 
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10

Fast Parallel High-Level Synthesis Design Space Explorer: T..:

, In: Proceedings of the Great Lakes Symposium on VLSI 2022,
 
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11

Predictive Model Attack for Embedded FPGA Logic Locking:

, In: Proceedings of the ACM/IEEE International Symposium on Low Power Electronics and Design,
 
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12

Hotspot Mitigation through Multi-Row Thermal-aware Re-Place..:

, In: 2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC),
Schafer, Benjamin Carrion - p. 629-634 , 2022
 
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13

Investigating the Effect of different eFPGAs fabrics on Log..:

, In: 2022 IEEE 15th Dallas Circuit And System Conference (DCAS),
 
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14

Improving the Quality of Hardware Accelerators through auto..:

, In: 2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC),
 
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