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Tsai, Meng-Yen
333  Ergebnisse:
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1

Machine Learning-Based Approaches for Tandem Romberg Test o..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Tsai, Yuan-Hua ; Li, Ju-Hsuan ; Lin, Yen-Chen.. - p. 211-213 , 2024
Link: https://doi.org/10.1109/..
 
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2

Void Migration Kinetics in Fine Line Cu RDL under Electric ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Huang, Yen-Cheng ; Tsai, Min-Yan ; Lin, Ting-Chun... - p. 576-580 , 2024
Link: https://doi.org/10.1109/..
 
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3

A Resistor-Based High-Resolution Temperature-to-Digital Con..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lee, Rui-Song ; Lam, Chak-Hong ; Chen, Wei-Hao... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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4

"I Prefer Regular Visitors to Answer My Questions": Users' ..:

, In: Proceedings of the CHI Conference on Human Factors in Computing Systems,
Lin, Fang-Yu ; Tsai, Pei-Hua ; Lee, Chia-Yi... - p. 1-18 , 2024
Link: https://dl.acm.org/doi/1..
 
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5

Solder Joint Reliability Comparison Under JEDEC Drop and Sy..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Shih, Meng-Kai ; Ke, Zih-Jun ; Yen, Chun-Yu.. - p. 153-154 , 2024
Link: https://doi.org/10.23919..
 
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6

Slack Redistributed Register Clustering with Mixed-Driving ..:

, In: Proceedings of the 2024 International Symposium on Physical Design,
Chen, Yen-Yu ; Wu, Hao-Yu ; Jiang, Iris Hui-Ru.. - p. 21-29 , 2024
Link: https://dl.acm.org/doi/1..
 
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7

Investigation of Micro Pyroelectric Infrared Sensor Perform..:

, In: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP),
Tsai, Chia-Yu ; Xiong, Zhen ; Lee, Chia-Yen - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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8

34.2 A 16nm 96Kb Integer/Floating-Point Dual-Mode-Gain-Cell..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Khwa, Win-San ; Wu, Ping-Chun ; Wu, Jui-Jen... - p. 568-570 , 2024
Link: https://doi.org/10.1109/..
 
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9

Burstiness-aware Bipartite Graph Neural Networks for Fraudu..:

, In: Companion Proceedings of the ACM on Web Conference 2024,
Lu, Yen-Wen ; Tsai, Yu-Che ; Li, Cheng-Te - p. 834-837 , 2024
Link: https://dl.acm.org/doi/1..
 
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10

Tribal Knowledge Cocreation in Generative Artificial Intell..:

, In: Proceedings of the 25th Annual International Conference on Digital Government Research,
Wang, Yi-Fan ; Chen, Yu-Che ; Huang, Yen-Chen.. - p. 637-644 , 2024
Link: https://dl.acm.org/doi/1..
 
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11

Convolutional Probabilistic Neural Network Approach for Fau..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Yen, Sheng-Chao ; Hsieh, Cheng-Yu ; Shih, Tung-Ting... - p. 01-03 , 2024
Link: https://doi.org/10.1109/..
 
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12

A Multimodal Analysis of Streaming Subscription:

, In: HCI in Business, Government and Organizations; Lecture Notes in Computer Science,
Lee, Yi-Cheng ; Yang, Yu-chen ; Lee, Yen-Hsien. - p. 200-208 , 2024
Link: https://doi.org/10.1007/..
 
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13

DepBoxia: Depth Perception Training in Boxing, an Immersive..:

, In: 2024 IEEE Conference on Virtual Reality and 3D User Interfaces Abstracts and Workshops (VRW),
Chen, Yen-Ru ; Tsai, Tsung-Hsun ; Lin, Tica... - p. 739-740 , 2024
Link: https://doi.org/10.1109/..
 
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14

8.11 A 48V-to-5V Buck Converter with Triple EMI Suppression..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Kao, Yi-Hsiang ; Hung, Chieh-Sheng ; Chang, Hui-Hsuan... - p. 164-166 , 2024
Link: https://doi.org/10.1109/..
 
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15

31.2 A Ripple-Less Buck Converter with Sub -21.94dB EVM for..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Kao, Yi-Hsiang ; Wu, Jie-Lin ; Huang, Wei-Cheng... - p. 498-500 , 2024
Link: https://doi.org/10.1109/..
 
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