Wang, Hsiao-Yu
526  Ergebnisse:
Personensuche X
?
1

A Comparative Study of the Transcritical CO2 Cycle and the ..:

, In: Springer Proceedings in Earth and Environmental Sciences; Environment and Renewable Energy,
 
?
2

A Novel Gate Driver with Charge Sharing Technique to Optimi..:

, In: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Hsiao, Yu-Sheng ; Yu, Wei-Chen ; Sung, Cheng... - p. 184-187 , 2024
 
?
3

Semi-classical Spectral Asymptotics of Toeplitz Operators o..:

, In: The Bergman Kernel and Related Topics; Springer Proceedings in Mathematics & Statistics,
Hsiao, Chin-Yu ; Marinescu, George - p. 239-259 , 2024
 
?
4

Test Compression for Neuromorphic Chips:

, In: 2024 IEEE European Test Symposium (ETS),
 
?
5

21.4 A -108dBc THD+N, 2.3mW Class-H Headphone Amplifier wit..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Wen, Shon-Hang ; Hsiao, Chuan-Hung ; Huang, Yi-Wei... - p. 384-386 , 2024
 
?
6

CITS 2024 General Chairs' Message:

, In: 2024 International Conference on Computer, Information and Telecommunication Systems (CITS),
 
?
7

Using Graph Neural Network to Ransomware Detection for Cybe..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Lin, Hsiao-Chung ; Wang, Ping ; Lin, Wen-Hui... - p. 314-316 , 2024
 
?
8

In-Mold Heat Radiating Simulation and Verification of In-Mo..:

, In: 2024 IEEE Intelligent Vehicles Symposium (IV),
Yao, Li-Wei ; Lin, Yi-Rong ; Lai, Chun-Chun.. - p. 3030-3034 , 2024
 
?
9

Designing Autonomous Vehicle Interactions for a Super-Aged ..:

, In: Lecture Notes in Computer Science; Human Aspects of IT for the Aged Population,
 
?
10

Performance and Analysis of Superconducting Resistive Fault..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Lin, Tun ; San, Moe Moe ; Htet, Soe Min.. - p. 52-54 , 2024
 
?
11

Driving a Ballbot Wheelchair with Hands-Free Torso Control:

, In: Proceedings of the 2024 ACM/IEEE International Conference on Human-Robot Interaction,
Song, Seung Yun ; Marin, Nadja ; Xiao, Chenzhang... - p. 678-686 , 2024
 
?
12

An Advanced Packaging Figure of Merit (AP-FoM) for Benchmar..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Wang, Chuei-Tang ; Shang, Shu-An ; Hsiao, Yu-Ming... - p. 1093-1097 , 2024
 
?
13

High Performance Antenna-in-Package with Test Socket for Mi..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Ho, Cheng-Yu ; Hsiao, Wen-Chun ; Hsieh, Sheng-Chi.. - p. 191-192 , 2024
 
?
14

A Machine Learning Study to Obtain an Optimal Processing Pu..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
 
?
15

A Novel Detection Applied on Micro Defect in Bump Interface..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Yi-Sheng ; Hsiao, Yu-Hsiang ; Liu, Cheng-Hsin... - p. 1804-1807 , 2024
 
1-15