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Yee Ho Chai
74  Ergebnisse:
Buchkapitel (Online) X
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1

Leveraging Mean Shift and Spectral Clustering: A Study on C..:

, In: 2024 3rd International Conference on Digital Transformation and Applications (ICDXA),
Lee, Pei Yee ; Chai, Kian Hun ; Lim, Siew Mooi. - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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2

DLVS4Audio2Sheet: Deep Learning-Based Vocal Separation for ..:

, In: Lecture Notes in Computer Science; Trends and Applications in Knowledge Discovery and Data Mining,
Teo, Nicole ; Wang, Zhaoxia ; Ghe, Ezekiel... - p. 95-107 , 2024
Link: https://doi.org/10.1007/..
 
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3

A Compact Wafer-Level Heterogeneously Integrated Scalable O..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Nair Gourikutty, Sajay Bhuvanendran ; Wu, Jiaqi ; Lim, Teck Guan... - p. 1398-1403 , 2024
Link: https://doi.org/10.1109/..
 
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4

Multi-purpose Dual Wire Rope Auto Balancing Climber:

, In: 2024 IEEE International Conference on Advanced Robotics and Its Social Impacts (ARSO),
Chan, Colin Pak Yu ; Koh, Keng Huat ; Shiu, Kin Hei... - p. 218-221 , 2024
Link: https://doi.org/10.1109/..
 
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5

Contributors:

, In: Circularity of Plastics,
Chai, Casandra Hui Teng ; Chan, Chui Yu ; Chen, Guo-Qiang... - p. xi-xiii , 2023
Link: https://doi.org/10.1016/..
 
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6

Detection of Ganoderma Boninense Diseases of Palm Oil Trees..:

, In: 2023 IEEE 13th Symposium on Computer Applications & Industrial Electronics (ISCAIE),
Haw, Yu Hong ; Zhao, Zhen ; Hum, Yan Chai... - p. 228-232 , 2023
Link: https://doi.org/10.1109/..
 
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7

Solutions for Process Challenges on Fan-Out Wafer Level Pac..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chia, Lai Yee ; Bhuvanendran Nair Gourikutty, Sajay ; Ho, Soon Wee - p. 20-23 , 2023
Link: https://doi.org/10.1109/..
 
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8

UAV Swarm Communication Reliability Prediction using Machin..:

, In: 2023 IEEE 8th International Conference on Recent Advances and Innovations in Engineering (ICRAIE),
Lim, Reuben Yaw Hui ; Lim, Joanne Mun Yee ; Lan, Boon Leong... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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9

Histopathological Gastric Cancer Detection Using Transfer L..:

, In: 2023 11th International Conference on Bioinformatics and Computational Biology (ICBCB),
Yong, Ming Ping ; Hum, Yan Chai ; Lai, Khin Wee... - p. 123-129 , 2023
Link: https://doi.org/10.1109/..
 
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10

A Heterogeneously Integrated Wafer-level Processed Co-Packa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Nair Gourikutty, Sajay Bhuvanendran ; Long, Lau Boon ; Wei, Seit Wen... - p. 207-211 , 2023
Link: https://doi.org/10.1109/..
 
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11

Basic principles of CO2 capture and conversion technologies:

, In: Nanomaterials for Carbon Dioxide Capture and Conversion Technologies,
Chai, Yee Ho ; Rashidi, Nor Adilla ; Mohamed, Mustakimah.. - p. 25-61 , 2023
Link: https://doi.org/10.1016/..
 
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12

List of contributors:

, In: Nanomaterials for Carbon Dioxide Capture and Conversion Technologies,
Ahmad, A.L. ; Ali, Esfand Yar ; Amiruddin, Muhammad Irfan... - p. xv-xviii , 2023
Link: https://doi.org/10.1016/..
 
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13

Transforming Nursing Education: The Hong Kong Experience:

, In: The Future of Nursing 2020-2030: Global Applications to Advance Health Equity,
Chau, Pui Hing ; Choi, Edmond Pui Hang ; Ho, Mandy... - p. 55-66 , 2023
Link: https://doi.org/10.1007/..
 
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14

Chipset Pin Pattern Design Impact on High-Speed Channel Cha..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hsu, Jimmy ; Ho, Brian ; Ho, Chiew Yee... - p. 203-206 , 2023
Link: https://doi.org/10.1109/..
 
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15

High-speed Channel Design and Correlation Between Signal In..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Ho, Brian ; Ho, Chiew Yee ; Hsu, Jimmy. - p. 298-301 , 2023
Link: https://doi.org/10.1109/..
 
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