Guan, Chen Gim
84  Ergebnisse:
Personensuche X
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2

Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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3

Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bondin:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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4

GHuNeRF: Generalizable Human NeRF from a Monocular Video:

, In: 2024 International Conference on 3D Vision (3DV),
Li, Chen ; Lin, Jiahao ; Lee, Gim Hee - p. 923-932 , 2024
 
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7

Electrical Characterization and Reliability Studies of Nano..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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8

Cu and barrier CMP process development with fine 1μm Cu bon..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
 
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10

DReg-NeRF: Deep Registration for Neural Radiance Fields:

, In: 2023 IEEE/CVF International Conference on Computer Vision (ICCV),
Chen, Yu ; Lee, Gim Hee - p. 22646-22656 , 2023
 
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11

Motion Planning Framework for Low Obstacle Traversal and Av..:

, In: Advances in Mechanism and Machine Science; Mechanisms and Machine Science,
 
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13

NeRF-DS: Neural Radiance Fields for Dynamic Specular Object:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),
Yan, Zhiwen ; Li, Chen ; Lee, Gim Hee - p. 8285-8295 , 2023
 
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14

AdaSfM: From Coarse Global to Fine Incremental Adaptive Str..:

, In: 2023 IEEE International Conference on Robotics and Automation (ICRA),
Chen, Yu ; Yu, Zihao ; Song, Shu... - p. 2054-2061 , 2023
 
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15

Weakly-supervised 3D Pose Transfer with Keypoints:

, In: 2023 IEEE/CVF International Conference on Computer Vision (ICCV),
Chen, Jinnan ; Li, Chen ; Lee, Gim Hee - p. 15110-15119 , 2023
 
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