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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bondin:
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2024 International Conference on 3D Vision (3DV) ,
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GHuNeRF: Generalizable Human NeRF from a Monocular Video:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Electrical Characterization and Reliability Studies of Nano..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Cu and barrier CMP process development with fine 1μm Cu bon..:
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2023 IEEE/CVF International Conference on Computer Vision (ICCV) ,
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DReg-NeRF: Deep Registration for Neural Radiance Fields:
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Advances in Mechanism and Machine Science; Mechanisms and Machine Science ,
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Motion Planning Framework for Low Obstacle Traversal and Av..:
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2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR) ,
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NeRF-DS: Neural Radiance Fields for Dynamic Specular Object:
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2023 IEEE International Conference on Robotics and Automation (ICRA) ,
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AdaSfM: From Coarse Global to Fine Incremental Adaptive Str..:
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2023 IEEE/CVF International Conference on Computer Vision (ICCV) ,
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