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2024 15th German Microwave Conference (GeMiC) ,
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In-Package Characterization of Dielectrics Using Ring Reson..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
8
How to Manipulate Warpage in Fan-out Wafer and Panel Level ..:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
11
Application of Machine Learning Methods for Process Optimiz..:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
13
High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer..:
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2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
14
A Closer Look to Fan-out Panel Level Packaging:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
15