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2024 International Conference on Electronics Packaging (ICEP) ,
6
Low-Temperature Cu-Cu Bonding using Nanocrystalline Grains:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
7
A 919GMACs/J Reconfigurable SIMD Array Processor for Baseba..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
13
3.8 A 0.65V 900µm² BEoL RC-Based Temperature Sensor with ±1..:
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2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC) ,
15