Personensuche
X
?
2023 International Electron Devices Meeting (IEDM) ,
1
3D sequential integration with Si CMOS stacked on 28nm indu..:
, In:
?
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
2
Methodology for Active Junction Profile Extraction in thin ..:
, In:
?
2021 IEEE International Electron Devices Meeting (IEDM) ,
9
3D sequential integration: applications and associated key ..:
, In:
?
2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) ,
14