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2024 47th International Spring Seminar on Electronics Technology (ISSE) ,
1
Board Level Underfill – Moisture Related Voids:
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2024 47th International Spring Seminar on Electronics Technology (ISSE) ,
2
Soil Degradation of Sustainable PLA/Flax Substrates and Pri..:
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2024 47th International Spring Seminar on Electronics Technology (ISSE) ,
4
Influence of Reflow Temperature Profile on the Intermetalli..:
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2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ,
5
Biodegradable and Water-Soluble DEG1 Substrate for Printed ..:
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2024 47th International Spring Seminar on Electronics Technology (ISSE) ,
6
Iron Nanoparticle-Doped Flux: Wetting Characteristics of Fl..:
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2024 47th International Spring Seminar on Electronics Technology (ISSE) ,
7
Investigation of Sn grain growth in solder joints by numeri..:
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2024 47th International Spring Seminar on Electronics Technology (ISSE) ,
9
Increasing Productivity in Vapour Phase Soldering Using Ver..:
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2024 18th European Conference on Antennas and Propagation (EuCAP) ,
12
Exploring PLA/Flax Substrates for Antenna Applications: Ass..:
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2024 47th International Spring Seminar on Electronics Technology (ISSE) ,
13
Electronic Nose Based on AI-capable Sensor Module for Bever..:
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2023 IEEE Industry Applications Society Annual Meeting (IAS) ,
14
Increasing and testing the filtration efficiency of masks u..:
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2023 46th International Spring Seminar on Electronics Technology (ISSE) ,
15