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Knickerbocker, John U.
30  Ergebnisse:
Personensuche X
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1

Open-source code maps traumas for targeting interventions: ..:

Draper, Allison ; Rose, Brandon ; Knickerbocker, Chase...
The American Journal of Surgery.  , 2024
Link: https://doi.org/10.1016/..
 
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2

A Case-Based, Longitudinal Curriculum in Pediatric Behavior..:

Kiger, Michelle E. ; Fowler, Lauryn ; Eviston, Maggie...
MedEdPORTAL.  , 2024
Link: https://doi.org/10.15766..
 
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3

Healthcare Wearable Sensors Adhesion to Human Fingernails a..:

Sakuma, Katsuyuki ; Pancoast, Leanna ; Yao, Yiping.
Micromachines.  15 (2023)  1 - p. 69 , 2023
Link: https://doi.org/10.3390/..
 
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4

Voids-free Die-level Cu/ILD Hybrid bonding:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sakuma, Katsuyuki ; Yu, Roy ; Polomoff, Nicholas... - p. 800-805 , 2023
Link: https://doi.org/10.1109/..
 
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5

Next Generation Infrared (IR) Laser Debonding / Silicon Han..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Qianwen ; Belyansky, Michael ; Sulehria, Yasir... - p. 1175-1180 , 2023
Link: https://doi.org/10.1109/..
 
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6

Surface Energy Characterization for Die-Level Cu Hybrid Bon..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Sakuma, Katsuyuki ; Yu, Roy ; Belyansky, Michael... - p. 312-316 , 2022
Link: https://doi.org/10.1109/..
 
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7

Thermal solution for Co-Packaged Optics (CPO) modules:

, In: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Matsumoto, Keiji ; Farooq, Mukta ; Knickerbocker, John - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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8

Panel Packaging Approach to Micro Thin-film Battery Sealing..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chen, Qianwen ; Dang, Bing ; Pancoast, Leanna... - p. 1560-1565 , 2020
Link: https://doi.org/10.1109/..
 
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9

Back to Finger-Writing: Fingertip Writing Technology Based ..:

Blumrosen, Gaddi ; Sakuma, Katsuyuki ; Rice, John Jeremy.
IEEE Access.  8 (2020)  - p. 35455-35468 , 2020
Link: https://doi.org/10.1109/..
 
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10

Face to Face Hybrid Wafer Bonding for Fine Pitch Applicatio..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Fisher, Daniel W. ; Knickerbocker, Sarah ; Smith, Daniel... - p. 595-600 , 2020
Link: https://doi.org/10.1109/..
 
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11

Flexible Piezoresistive Sensors Fabricated by Spalling Tech..:

, In: 2018 International Flexible Electronics Technology Conference (IFETC),
Sakuma, Katsuyuki ; Hu, Huan ; Bedell, Stephen W.... - p. 1 - 2 , 2018
Link: https://doi.org/10.1109/..
 
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12

Heterogeneous Integration Technology Demonstrations for Fut..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Knickerbocker, John U. ; Budd, R. ; Dang, B.... - p. 1519-1528 , 2018
Link: https://doi.org/10.1109/..
 
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13

An overview of through-silicon-via technology and manufactu..:

Gambino, Jeffrey P. ; Adderly, Shawn A. ; Knickerbocker, John U.
Microelectronic Engineering.  135 (2015)  - p. 73-106 , 2015
Link: https://doi.org/10.1016/..
 
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14

More Than Moore - Wafer Scale Integration of Dissimilar Mat..:

, In: 2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS),
Kazior, Thomas E. ; LaRoche, Jeffery R. ; Ip, Kelly... - p. 1-1 , 2015
Link: https://doi.org/10.1109/..
 
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15

Development of vacuum underfill technology for a 3D chip st..:

Sakuma, Katsuyuki ; Kohara, Sayuri ; Sueoka, Kuniaki...
Journal of Micromechanics and Microengineering.  21 (2011)  3 - p. 035024 , 2011
Link: https://doi.org/10.1088/..
 
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