Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Kteyan, A.
24  Ergebnisse:
Personensuche X
?
1

A Unified Physics-Based Stochastic Model for EM-Induced Res..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Sukharev, V. ; Choy, J.-H. ; Kteyan, A.... - p. 1-10 , 2024
Link: https://doi.org/10.1109/..
 
?
2

Warpage Study by Employing an Advanced Simulation Methodolo..:

, In: Proceedings of the 2024 International Symposium on Physical Design,
Choy, Jun-Ho ; Moreau, Stéphane ; Brunet-Manquat, Catherine.. - p. 85-90 , 2024
Link: https://dl.acm.org/doi/1..
 
?
3

Electromigration Test Chip Experiments from Realistic Power..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Yi, Yong Hyeon ; Kim, Chris ; Kteyan, Armen... - p. 01-06 , 2024
Link: https://doi.org/10.1109/..
 
?
4

A Novel Method for the Determination of Electromigration-In..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Shuster-Passage, J. ; Razek, S. Abdel ; Mattoo, M.... - p. 10A.4-1-10A.4-6 , 2024
Link: https://doi.org/10.1109/..
 
?
5

Electromigration Assessment in Power Grids with Account of ..:

, In: Proceedings of the 2023 International Symposium on Physical Design,
Kteyan, Armen ; Sukharev, Valeriy ; Volkov, Alexander... - p. 124-132 , 2023
Link: https://dl.acm.org/doi/1..
 
?
6

Studying the Impact of Temperature Gradient on Electromigra..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Yi, Yong Hyeon ; Kim, Chris ; Zhou, Chen.. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
?
7

Novel Methodology for Assessing Chip-Package Interaction Ef..:

, In: Proceedings of the 2022 International Symposium on Physical Design,
Kteyan, Armen ; Choy, Jun-Ho ; Sukharev, Valeriy... - p. 83-89 , 2022
Link: https://dl.acm.org/doi/1..
 
?
8

Experimental Validation of a Novel Methodology for Electrom..:

Sukharev, Valeriy ; Kteyan, Armen ; Najm, Farid N....
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  41 (2022)  11 - p. 4837-4850 , 2022
Link: https://doi.org/10.1109/..
 
?
9

Novel methodology for temperature-aware electromigration as..:

, In: 2022 IEEE International Reliability Physics Symposium (IRPS),
Kteyan, A. ; Sukharev, V. ; Yi, Y.. - p. 1-10 , 2022
Link: https://doi.org/10.1109/..
 
?
10

Physics-based simulation of stress-induced and electromigra..:

Kteyan, Armen ; Sukharev, Valeriy
Microelectronic Engineering.  247 (2021)  - p. 111585 , 2021
Link: https://doi.org/10.1016/..
 
?
11

An Accurate Assessment of Chip-Package Interaction is a Key..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Sukharev, Valeriy ; Kteyan, Armen ; Choy, Jun-Ho - p. 1-6 , 2019
Link: https://doi.org/10.1109/..
 
?
12

ZnO film deposition by DC magnetron sputtering: Effect of t..:

Arakelova, E. ; Khachatryan, A. ; Kteyan, A...
Thin Solid Films.  612 (2016)  - p. 407-413 , 2016
Link: https://doi.org/10.1016/..
 
?
13

Epilepsy care in Armenia. Data of 3382 consecutive epilepti..:

Yeghiazaryan, N.S. ; Khechumyan, Z. ; Kteyan, A....
Journal of the Neurological Sciences.  333 (2013)  - p. e55-e56 , 2013
Link: https://doi.org/10.1016/..
 
?
14

Optimization of magnetron deposition process for formation ..:

Arakelova, E. R. ; Khachatryan, A. M. ; Avjyan, K. E..
Journal of Contemporary Physics (Armenian Academy of Sciences).  47 (2012)  4 - p. 181-188 , 2012
Link: https://doi.org/10.3103/..
 
?
15

Multi-scale Simulation Methodology for Stress Assessment in..:

Sukharev, Valeriy ; Kteyan, Armen ; Choy, Jun-Ho...
Journal of Electronic Testing.  28 (2011)  1 - p. 63-72 , 2011
Link: https://doi.org/10.1007/..
 
1-15