Lang, Gernot
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FEM simulation of influence of different polymeric module m..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Lang, Margit ; Oreski, Gernot ; Helfer, Eric... - p. 1-8 , 2023
 
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