Leiming, Du
~ 100  Ergebnisse:
Personensuche X
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2

Investigating Mechanical Properties of Silicon Carbide Coat..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
Mo, Jiarui ; Schaffar, Gerald J.K. ; Du, Leiming... - p. 626-629 , 2024
 
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4

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nan..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ji, Xinrui ; Du, Leiming ; van Zeijl, Henk... - p. 1891-1895 , 2024
 
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5

Microstructure features induced by fatigue crack initiation..:

Pan, Xiangnan ; Du, Leiming ; Qian, Guian.
Journal of Materials Science & Technology.  173 (2024)  - p. 247-260 , 2024
 
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6

Microscopic fracture toughness of notched porous sintered C..:

Hu, Dong ; Du, Leiming ; Alfreider, Markus...
Materials Science and Engineering: A.  897 (2024)  - p. 146316 , 2024
 
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8

Kaempferol mitigates sepsis-induced acute lung injury by mo..:

Gao, Meijuan ; Zhu, Xuan ; Gao, XiaoJin...
Chemico-Biological Interactions.  398 (2024)  - p. 111085 , 2024
 
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9

Multi-parameters optimization for electromigration in WLCSP..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Du, Leiming ; Deng, Shanliang ; Cui, Zhen... - p. 1-4 , 2024
 
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10

TagP, a PAAR-domain containing protein, plays roles in the ..:

Li, Yanbing ; Cui, Yiming ; Song, Kai...
Frontiers in Cellular and Infection Microbiology.  14 (2024)  - p. , 2024
 
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11

Development and evaluation of a multi-target droplet digita..:

Zhao, Yanting ; Yan, Ziheng ; Song, Kai...
PLOS Neglected Tropical Diseases.  18 (2024)  5 - p. e0012167 , 2024
 
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12

Bioactivity of the DMI fungicide mefentrifluconazole agains..:

Han, Zhiyuan ; Cui, Kaidi ; Wang, Mengke...
Pest Management Science.  79 (2023)  6 - p. 2126-2134 , 2023
 
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13

Low Temperature Fine Pitch All-Copper Interconnects Combini..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Ji, Xinrui ; Van Zeijl, Henk ; Jiao, Weiping... - p. 1237-1243 , 2023
 
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14

High-temperature creep properties of a novel solder materia..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Du, Leiming ; Zhao, Xiujuan ; Poelma, Rene.. - p. 392-395 , 2023
 
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15

Connecting the macroscopic and mesoscopic properties of sin..:

Long, Xu ; Chong, Kainan ; Su, Yutai..
Engineering Fracture Mechanics.  281 (2023)  - p. 109137 , 2023
 
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