Lim Pei Siang, Sharon
51  Ergebnisse:
Personensuche X
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2

Vertical Stacking of Heterogeneous Chiplets of Duplexer on ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chong, Chai Tai ; Rotaru, Mihai ; Xiangyu, Wang... - p. 2017-2023 , 2024
 
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5

Circular Synergy between Biomass and Petroleum Industry in ..:

Yeo, Lip Siang ; Ng, Wendy Pei Qin ; Lim, Chun Hsion...
ACS Sustainable Chemistry & Engineering.  11 (2023)  35 - p. 12916-12933 , 2023
 
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6

Residence time distribution of an offshore floating photobi..:

Khor, Wei Han ; Goh, Jie Heng ; Yew, Qi Ming...
Chemical Engineering Research and Design.  198 (2023)  - p. 340-348 , 2023
 
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7

3D Stacking of Heterogeneous Chiplets on Modified FOWLP Pla..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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8

Assembly process characterization of 3D Stacking of Heterog..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
 
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11

Numerical and Experimental Investigation of Package Warpage..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
 
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13

Assembly challenges and demonstrations of ultra-large Anten..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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14

A Novel Packaging Platform for High-Performance Optical Eng..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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15

NetFlex: A 22nm Multi-Chiplet Perception Accelerator in Hig..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Chou, Teyuh ; Tang, Wei ; Rotaru, Mihai D.... - p. 208-209 , 2022
 
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