Pinomaa, Tatu
52  Ergebnisse:
Personensuche X
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1

OpenPFC: an open-source framework for high performance 3D p..:

Pinomaa, Tatu ; Aho, Jukka ; Suviranta, Jaarli...
Modelling and Simulation in Materials Science and Engineering.  32 (2024)  4 - p. 045002 , 2024
 
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Single-Track Laser Scanning as a Method for Evaluating Prin..:

Antikainen, Atte ; Reijonen, Joni ; Lagerbom, Juha...
Journal of Materials Engineering and Performance.  31 (2022)  10 - p. 8418-8432 , 2022
 
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10

Dislocation density in cellular rapid solidification using ..:

Lindroos, Matti ; Pinomaa, Tatu ; Ammar, Kais...
International Journal of Plasticity.  148 (2022)  - p. 103139 , 2022
 
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11

Multiscale analysis of crystalline defect formation in rapi..:

Pinomaa, Tatu ; Lindroos, Matti ; Jreidini, Paul...
Pinomaa , T , Lindroos , M , Jreidini , P , Haapalehto , M , Ammar , K , Wang , L , Forest , S , Provatas , N & Laukkanen , A 2022 , ' Multiscale analysis of crystalline defect formation in rapid solidification of pure aluminium and aluminium-copper alloys ' , Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences , vol. 380 , no. 2217 , 20200319 . https://doi.org/10.1098/rsta.2020.0319.  , 2022
 
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12

Single-Track Laser Scanning as a Method for Evaluating Prin..:

Antikainen, Atte ; Reijonen, Joni ; Lagerbom, Juha...
Antikainen , A , Reijonen , J , Lagerbom , J , Lindroos , M , Pinomaa , T & Lindroos , T 2022 , ' Single-Track Laser Scanning as a Method for Evaluating Printability: The Effect of Substrate Heat Treatment on Melt Pool Geometry and Cracking in Medium Carbon Tool Steel ' , Journal of Materials Engineering and Performance . https://doi.org/10.1007/s11665-022-06826-0.  , 2022
 
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13

An atomistic simulation study of rapid solidification kinet..:

Haapalehto, Matias ; Pinomaa, Tatu ; Wang, Lei.
Haapalehto , M , Pinomaa , T , Wang , L & Laukkanen , A 2022 , ' An atomistic simulation study of rapid solidification kinetics and crystal defects in dilute Al–Cu alloys ' , Computational Materials Science , vol. 209 , 111356 . https://doi.org/10.1016/j.commatsci.2022.111356.  , 2022
 
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