Tatsumi, Hiroshi
843  Ergebnisse:
Personensuche X
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2

Ag Sintered Joints on ENIG Cu Substrates by an Ag-Based Com..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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5

Analysis of microstructures and fractures in Ag–In transien..:

Liu, Xunda ; Tatsumi, Hiroaki ; Wang, Jianhao...
Materials Science and Engineering: A.  892 (2024)  - p. 146045 , 2024
 
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7

Low Thermal Resistance Joint Using Lotus-type Cu/Solder Com..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Tatsumi, Hiroaki ; Isono, Hiroshi ; Hirase, Kana.. - p. 51-52 , 2024
 
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9

Joint Strength of Transient Liquid Phase Bonding Using Cu-S..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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14

A case of suspected autoimmune encephalopathy with involunt..:

Tenpaku, Yosuke ; Mabuchi, Naoki ; Kawase, Takahiro...
Psychiatry and Clinical Neurosciences Reports.  3 (2024)  3 - p. , 2024
 
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15

Transparent Liquid Ag-Based Complex for the Facile Preparat..:

Wang, Chuncheng ; Tatsumi, Hiroaki ; Xu, Liang...
ACS Applied Electronic Materials.  6 (2024)  3 - p. 1718-1728 , 2024
 
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