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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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A Study of Low Temperature SoIC Targeting 200 nm Bond Pitch:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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An Energy-efficient Si-integrated Micro-cooler for High Pow..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
13