Chiang, T. C.
238  Ergebnisse:
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1

A robust mesh size control technology suitable for various ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chiang, Kuo-Ning ; Lee, C. E. ; Yuan, Cadmus - p. 234-239 , 2024
 
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2

A Comprehensive Hot Carrier Injection with Voltage Ramp Str..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Chiang, C. H. ; Sou, K. P. ; Huang, D. S.. - p. 1-4 , 2024
 
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3

Recent Observations with the Mapper of the IGM Spin Tempera..:

, In: 2024 United States National Committee of URSI National Radio Science Meeting (USNC-URSI NRSM),
Chiang, H. C. - p. 83-83 , 2024
 
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4

Sensitivity Study of Wafer-Level Packaging Lifetime Predict..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Lee, C. E. ; Yuan, Cadmus ; Chiang, K. N. - p. 1-5 , 2024
 
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5

Warpage Estimation of Panel-Level Packaging by AI-assisted ..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Chen, Y.C. ; Chiang, K.N. - p. 1-5 , 2024
 
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6

Fatigue driving detection based on YOLOv7 algorithm and MEC..:

, In: IET International Conference on Engineering Technologies and Applications (ICETA 2023),
Shi, R. -H. ; Chiang, Y. -C. ; Chen, H. -Y.... - p. None , 2023
 
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7

A novel and simple method of low temperature, low process t..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Huang, Jeng-Hau ; Shih, Po-Shao ; Shen, Chang-Hsien... - p. 1660-1663 , 2023
 
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8

MOSFET Characterization with Reduced Supply Voltage at Low ..:

, In: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC),
Lin, W.-C. ; Huang, H.-P. ; Kao, K.-H.... - p. 9-12 , 2023
 
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9

Test Generation for Defect-Based Faults of Scan Flip-Flops:

, In: 2023 IEEE 41st VLSI Test Symposium (VTS),
Nien, Yu-Teng ; Li, Chen-Hong ; Wu, Pei-Yin... - p. 1-7 , 2023
 
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10

High temporal and spatial resolution upright Motion-tracked..:

, In: 2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD),
Wang, Z. ; Tan, W. ; Chiang, G.C.-Y... - p. 1-2 , 2023
 
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11

Malignant Neoplasms of the Small Intestines:

, In: Atlas of Small Intestinal Disorders,
Hu, Ming-Luen ; Chiu, Yi-Chun ; Tai, Wei-Chen... - p. 19-45 , 2023
 
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12

Combining Process Modeling and Machine Learning Technology ..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chen, Y.C. ; Chen, H. L. ; Chiang, K.N. - p. 54-58 , 2023
 
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13

Use Artificial Neural Network to fit stress-strain curve of..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lee, C.E. ; Yuan, Cadmus ; Chiang, K.N. - p. 137-142 , 2023
 
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14

Interworking between SNMP and OM2M supporting the bulk oper..:

, In: IET International Conference on Engineering Technologies and Applications (ICETA 2023),
Lee, C. -H. ; Chiang, C. -L. - p. None , 2023
 
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15

Pulsatile Impedance Monitoring Circuit:

, In: 2023 Intermountain Engineering, Technology and Computing (IETC),
Poff, Sharisse ; Tebbs, Daniel ; Davis, Robert C.. - p. 203-208 , 2023
 
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