E-LIB Suche - Ergebnisse für: Jung, W J

1

Towards an Effective Means of Collecting Validated Behaviou..:

, In: 2024 IEEE Conference on Virtual Reality and 3D User Interfaces Abstracts and Workshops (VRW),

Kumarapeli, Dilshani ; Jung, Sungchul ; Lindeman, Robert W. - p. 501-506 , 2024

Link: https://doi.org/10.1109/..

2

(Social) Trouble on the Road: Understanding and Addressing ..:

, In: Proceedings of the 6th ACM Conference on Conversational User Interfaces,

Bremers, Alexandra W.D. ; Friedman, Natalie ; Lee, Sam... - p. 1-13 , 2024

Link: https://dl.acm.org/doi/1..

3

List of contributors:

, In: Rehabilitation Robots for Neurorehabilitation in High-, Low-, and Middle-Income Countries,

Ad Adams, Ebenezer ; Adebowale, Akintunde ; Agrawal, Abha... - p. xxi-xxviii , 2024

Link: https://doi.org/10.1016/..

4

Device Design and Reliability of GAA MBCFET:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),

Kang, M. ; Chang, M. ; Park, Y.... - p. 1-6 , 2024

Link: https://doi.org/10.1109/..

5

List of contributors:

, In: Molecular Medical Microbiology,

Aizawa, Shin-Ichi ; Alberdi, Pilar ; Alexander, David C.... - p. xv-xxx , 2024

Link: https://doi.org/10.1016/..

6

Student Presentations of Mathematical Modelling Solutions a..:

, In: International Perspectives on the Teaching and Learning of Mathematical Modelling; Advancing and Consolidating Mathematical Modelling,

Brady, Corey ; Jung, Hyunyi ; McLean, Jeffrey A... - p. 61-76 , 2023

Link: https://doi.org/10.1007/..

7

Modifying of solder composition as MXT03 for high TC reliab..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),

Son, J.Y. ; Lee, S.G. ; Lee, Y.W.. - p. 970-973 , 2023

Link: https://doi.org/10.1109/..

8

Enhancement of Thermal cycle and Drop Shock Reliability at ..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),

Son, J.Y. ; Lee, S.G. ; Park, J.W... - p. 106-110 , 2023

Link: https://doi.org/10.1109/..

9

Highly Manufacturable, Cost-Effective, and Monolithically S..:

, In: 2023 International Electron Devices Meeting (IEDM),

Ha, Daewon ; Lee, Wonsok ; Cho, M.H.... - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

10

Reputation as Contextual Knowledge: Incentives and External..:

, In: 2023 IEEE International Conference on Blockchain and Cryptocurrency (ICBC),

Bartholic, Michael ; Burger, Eric W. ; Matsuo, Shin'ichiro. - p. 1-9 , 2023

Link: https://doi.org/10.1109/..

11

List of contributors:

, In: The Produce Contamination Problem,

Anderson-Coughlin, Brienna L. ; Ayala-Zavala, J. Fernando ; Burris, Kellie P.... - p. xvii-xviii , 2023

Link: https://doi.org/10.1016/..

12

A 22nm 8Mb STT-MRAM Near-Memory-Computing Macro with 8b-Pre..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),

Chiu, Yen-Cheng ; Khwa, Win-San ; Li, Chung-Yuan... - p. 496-498 , 2023

Link: https://doi.org/10.1109/..

13

Vascular Disorders of the Small Intestines:

, In: Atlas of Small Intestinal Disorders,

Hsu, Wen-Hung ; Yu, Fang-Jung ; Wu, Deng-Chyang... - p. 69-84 , 2023

Link: https://doi.org/10.1007/..

14

Highly Reliable and Manufacturable MRAM embedded in 14nm Fi..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),

Ko, S. ; Park, J. H. ; Bak, J. H.... - p. 1-2 , 2023

Link: https://doi.org/10.23919..

15

Ongoing Evolution of DRAM Scaling via Third Dimension -Vert..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),

Han, J.W. ; Park, S.H. ; Jeong, M.Y.... - p. 1-2 , 2023

Link: https://doi.org/10.23919..