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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Signal & Power Integrity Optimization Utilizing Silicon Cor..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Fine Pitch (≤ 10μm) Die to Wafer Cu-Cu TCB on Organic Polym..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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Novel CMP Material Solution To Enable High Removal Rate Die..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Optimization of 2.5D Organic Interposer Channel for Die and..:
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2020 IEEE Symposium on VLSI Technology ,
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Low Temperature Cu/SiO2 Hybrid Bonding with Metal Passivati..:
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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
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New and Unique CMP Material Solution for the Enablement of ..:
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Handbook for Cleaning/Decontamination of Surfaces ,
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