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X
Wang, Sung Eun
213  Ergebnisse:
Buchkapitel (Online) X
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1

Vertical Fan Out(VFO) package with enhanced form factor and..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Sung, Ki-Jun ; Eun, Kyoungtae ; Kim, Jae-Min... - p. 34-39 , 2024
Link: https://doi.org/10.1109/..
 
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2

Development of In-Pipe Inspection Robot for Large-Diameter ..:

, In: Intelligent Autonomous Systems 18; Lecture Notes in Networks and Systems,
Jeon, Kwang-Woo ; Chung, Hyun-Joon ; Jung, Eui-Jung... - p. 443-452 , 2024
Link: https://doi.org/10.1007/..
 
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3

2.4 ATOMUS: A 5nm 32TFLOPS/128TOPS ML System-on-Chip for La..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Yu, Chang-Hyo ; Kim, Hyo-Eun ; Shin, Sungho... - p. 42-44 , 2024
Link: https://doi.org/10.1109/..
 
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4

A 5G FR2 n260/n259 Phased-Array Transmitter Front-End IC in..:

, In: 2024 IEEE Radio Frequency Integrated Circuits Symposium (RFIC),
Yun, Jongwon ; Lim, Hongkie ; Jeong, Jaeyeon... - p. 267-270 , 2024
Link: https://doi.org/10.1109/..
 
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5

52.5 TOPS/W 1.7GHz Reconfigurable XGBoost Inference Acceler..:

, In: 2024 IEEE Custom Integrated Circuits Conference (CICC),
Song, Chang Eun ; Li, Yidong ; Ramnani, Amardeep... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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6

Redefining Activity Tracking Through Older Adults' Reflecti..:

, In: Proceedings of the CHI Conference on Human Factors in Computing Systems,
Wang, Yiwen ; Li, Mengying ; Kim, Young-Ho... - p. 1-15 , 2024
Link: https://dl.acm.org/doi/1..
 
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7

List of Contributors:

, In: Hydrogels for Tissue Engineering and Regenerative Medicine,
Alemán, María Elena ; Ambrosio, Luigi ; Annabi, Nasim... - p. xv-xxiii , 2024
Link: https://doi.org/10.1016/..
 
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8

HAL: Hardware-assisted Load Balancing for Energy-efficient ..:

, In: 2024 ACM/IEEE 51st Annual International Symposium on Computer Architecture (ISCA),
Huang, Jinghan ; Lou, Jiaqi ; Vanavasam, Srikar... - p. 613-627 , 2024
Link: https://doi.org/10.1109/..
 
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9

Towards Pareto Optimal Throughput in Small Language Model S..:

, In: Proceedings of the 4th Workshop on Machine Learning and Systems,
Recasens, Pol G. ; Zhu, Yue ; Wang, Chen... - p. 144-152 , 2024
Link: https://dl.acm.org/doi/1..
 
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10

9.6 A 6th-Order Quadrature CTDSM using Double-OTA and Quadr..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lee, Jongmi ; Cho, Seong-Eun ; Lee, Jaehoon... - p. 178-180 , 2024
Link: https://doi.org/10.1109/..
 
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11

Experimental and Numerical Investigation of Cu-Cu Direct Bo..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Oh, Sung-Hyun ; Lee, Hyun-Dong ; Lee, Jae-Uk... - p. 1628-1632 , 2024
Link: https://doi.org/10.1109/..
 
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12

Full-Length Hardness Prediction in Wire Rod Manufacturing U..:

, In: Industrial Engineering and Applications – Europe; Lecture Notes in Business Information Processing,
Pyo, Seok-Kyu ; Hur, Sung-Jun ; Lee, Dong-Hee... - p. 189-199 , 2024
Link: https://doi.org/10.1007/..
 
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13

Controllable Text-to-Image Synthesis for Multi-Modality MR ..:

, In: 2024 IEEE/CVF Winter Conference on Applications of Computer Vision (WACV),
Kim, Kyuri ; Na, Yoonho ; Ye, Sung-Joon... - p. 7921-7930 , 2024
Link: https://doi.org/10.1109/..
 
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14

Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bon..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 943-948 , 2024
Link: https://doi.org/10.1109/..
 
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15

Reliability of Indium Solder Joints using a Laser-Assisted ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Jung, Ji Eun ; Eom, Yong-Sung ; Joo, Jiho... - p. 2237-2243 , 2024
Link: https://doi.org/10.1109/..
 
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