Wu, Ting-Jui
185  Ergebnisse:
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1

31.4 98.7% Efficiency 1200V-to-48V LLC Converter with CC/CV..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Wang, Tz-Wun ; Hung, Sheng-Hsi ; Chiu, Po-Jui... - p. 502-504 , 2024
 
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2

Performance Comparison of Direct Digital Control and DQ-bas..:

, In: 2024 IEEE Applied Power Electronics Conference and Exposition (APEC),
Wu, Tasi-Fu ; Hung, Chien-Chih ; Kumari, Anumeha.. - p. 1888-1892 , 2024
 
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3

CMOS-MEMS Tuned-Mass-Damper Based Physical Unclonable Funct..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
Chung, I-Fei ; Chen, Ting-Yi ; Liou, Ting-Jui. - p. 517-520 , 2024
 
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4

15.9 A 16nm 16Mb Embedded STT-MRAM with a 20ns Write Time, ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lin, Ku-Feng ; Noguchi, Hiroki ; Shih, Yi-Chun... - p. 292-294 , 2024
 
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6

Suppression of Subsynchronous Resonance in a Hybrid Steam-T..:

, In: 2024 IEEE/IAS 60th Industrial and Commercial Power Systems Technical Conference (I&CPS),
Wang, Li ; Lai, Jui-Tse ; Li, Ting-You... - p. 1-8 , 2024
 
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7

New Compensation Strategy of the Active Power Filter Integr..:

, In: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia),
 
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8

Device Engineering and Benefit Maximization for Advanced Cr..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Chiang, Hung-Li ; Wu, Jui-Jen ; Liao, Pei-Jun... - p. 1-2 , 2024
 
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9

7.7 A 2.16pJ/b 112Gb/s PAM-4 Transceiver with Time-Interlea..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lin, Yen-Po ; Peng, Pen-Jui ; Lu, Chun-Chang... - p. 136-138 , 2024
 
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10

Cu Nanoparticle Sintering by Electrical Current:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Wu, Albert T. ; Sheng, Tzu-Hao ; Chao, Jui-Lin.. - p. 107-108 , 2024
 
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11

Utilizing Skip-Gram for Restaurant Vector Creation and Its ..:

, In: Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering; Smart Grid and Internet of Things,
Chang, Chih-Yung ; Jhang, Syu-Jhih ; Yang, Yu-Ting.. - p. 141-147 , 2024
 
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12

Advanced Thermocompression Bonding on High Density Fan-Out ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Wudjud, Wiwy ; Lin, ShuYu ; Chang, Yungshun... - p. 929-935 , 2024
 
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13

34.2 A 16nm 96Kb Integer/Floating-Point Dual-Mode-Gain-Cell..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Khwa, Win-San ; Wu, Ping-Chun ; Wu, Jui-Jen... - p. 568-570 , 2024
 
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14

Aluminum to copper thermal compression bonding for heteroge..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Sahoo, Krutikesh ; Harish, Vineeth ; Liu, Jui-Han... - p. 1940-1946 , 2024
 
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15

Toward High-Bit-Rate CMOS-MEMS Resoswitches:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
Lee, Cheng-Ming ; Liou, Ting-Jui ; Tsai, Chun-Pu.. - p. 178-181 , 2024
 
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