Adler, Friedrich Ill
137  Ergebnisse:
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7

Key Technologies and Design Aspects for Wafer Level Packagi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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How to Manipulate Warpage in Fan-out Wafer and Panel Level ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Holck, Ole ; Adler, Marius... - p. 1-6 , 2024
 
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10

Why is the Winner the Best?:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),
Eisenmann, M. ; Reinke, A. ; Weru, V.... - p. 19955-19966 , 2023
 
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15

Robust hand tracking for surgical telestration:

Müller, Lucas-Raphael ; Petersen, Jens ; Yamlahi, Amine...
International Journal of Computer Assisted Radiology and Surgery.  17 (2022)  8 - p. 1477-1486 , 2022
 
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