Chung, Dai-Jung
1781  Ergebnisse:
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1

Advanced Fan-Out Embedded Chip Process Integration for 3D A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsiao, Chih-Cheng ; Hsu, Chao-Kai ; Li, Ching-Iang... - p. 181-182 , 2024
 
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6

Using Graph Neural Network to Ransomware Detection for Cybe..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Lin, Hsiao-Chung ; Wang, Ping ; Lin, Wen-Hui... - p. 314-316 , 2024
 
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9

Layout Guidelines against Charging Damage from the Well-Sid..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Kuo, Hsi-Yu ; Chu, Yu-Lin ; Dai, Hung-Da... - p. 1-6 , 2024
 
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11

Improving Modulation Bandwidth and Detection Performance of..:

Lu, Tingwei ; Lai, Shouqiang ; Dai, Yurong...
IEEE Electron Device Letters.  45 (2024)  3 - p. 332-335 , 2024
 
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